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PIC18F23K22-E/SO PDF预览

PIC18F23K22-E/SO

更新时间: 2024-11-18 06:03:31
品牌 Logo 应用领域
美国微芯 - MICROCHIP 微控制器
页数 文件大小 规格书
494页 5012K
描述
28/40/44-Pin, Low-Power, High-Performance Microcontrollers with nanoWatt XLP Technology

PIC18F23K22-E/SO 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:SOIC
包装说明:7.50 MM, LEAD FREE, PLASTIC, SOIC-28针数:28
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.31.00.01Factory Lead Time:9 weeks
风险等级:5.19具有ADC:YES
其他特性:ALSO OPERATES 2.3V MINIMUM SUPPLY AT 16 MHZ地址总线宽度:
位大小:8CPU系列:PIC
最大时钟频率:64 MHzDAC 通道:YES
DMA 通道:NO外部数据总线宽度:
JESD-30 代码:R-PDSO-G28JESD-609代码:e3
长度:17.9 mm湿度敏感等级:1
I/O 线路数量:25端子数量:28
片上程序ROM宽度:16最高工作温度:125 °C
最低工作温度:-40 °CPWM 通道:YES
封装主体材料:PLASTIC/EPOXY封装代码:SOP
封装等效代码:SOP28,.4封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):250
电源:2/5 V认证状态:Not Qualified
RAM(字节):512ROM(单词):4096
ROM可编程性:FLASH座面最大高度:2.65 mm
速度:48 MHz子类别:Microcontrollers
最大压摆率:12 mA最大供电电压:5.5 V
最小供电电压:2.7 V标称供电电压:5 V
表面贴装:YES技术:CMOS
温度等级:AUTOMOTIVE端子面层:Matte Tin (Sn) - annealed
端子形式:GULL WING端子节距:1.27 mm
端子位置:DUAL处于峰值回流温度下的最长时间:40
宽度:7.5 mmuPs/uCs/外围集成电路类型:MICROCONTROLLER, RISC
Base Number Matches:1

PIC18F23K22-E/SO 数据手册

 浏览型号PIC18F23K22-E/SO的Datasheet PDF文件第2页浏览型号PIC18F23K22-E/SO的Datasheet PDF文件第3页浏览型号PIC18F23K22-E/SO的Datasheet PDF文件第4页浏览型号PIC18F23K22-E/SO的Datasheet PDF文件第5页浏览型号PIC18F23K22-E/SO的Datasheet PDF文件第6页浏览型号PIC18F23K22-E/SO的Datasheet PDF文件第7页 
PIC18(L)F2X/4XK22  
Data Sheet  
28/40/44-Pin, Low-Power,  
High-Performance Microcontrollers  
with nanoWatt XLP Technology  
2010 Microchip Technology Inc.  
Preliminary  
DS41412A  

PIC18F23K22-E/SO 替代型号

型号 品牌 替代类型 描述 数据表
PIC18F25K22-E/SO MICROCHIP

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28/40/44-Pin, Low-Power, High-Performance Microcontrollers with nanoWatt XLP Technology
PIC18F25K22-I/SO MICROCHIP

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28/40/44-Pin, Low-Power, High-Performance Microcontrollers with nanoWatt XLP Technology
PIC18F23K22-I/SO MICROCHIP

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28/40/44-Pin, Low-Power, High-Performance Microcontrollers with nanoWatt XLP Technology

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