是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | SSOP |
包装说明: | SSOP, SSOP28,.3 | 针数: | 28 |
Reach Compliance Code: | compliant | ECCN代码: | 3A991.A.2 |
HTS代码: | 8542.31.00.01 | Factory Lead Time: | 13 weeks |
风险等级: | 5.17 | 具有ADC: | YES |
地址总线宽度: | 位大小: | 8 | |
CPU系列: | PIC | 最大时钟频率: | 64 MHz |
DAC 通道: | NO | DMA 通道: | NO |
外部数据总线宽度: | JESD-30 代码: | R-PDSO-G28 | |
JESD-609代码: | e3 | 长度: | 10.2 mm |
湿度敏感等级: | 1 | I/O 线路数量: | 25 |
端子数量: | 28 | 片上程序ROM宽度: | 16 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
PWM 通道: | YES | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | SSOP | 封装等效代码: | SSOP28,.3 |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE, SHRINK PITCH |
峰值回流温度(摄氏度): | 260 | 电源: | 2/3.3 V |
认证状态: | Not Qualified | RAM(字节): | 512 |
ROM(单词): | 4096 | ROM可编程性: | FLASH |
座面最大高度: | 2 mm | 速度: | 64 MHz |
子类别: | Microcontrollers | 最大压摆率: | 15 mA |
最大供电电压: | 3.6 V | 最小供电电压: | 1.8 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子面层: | Matte Tin (Sn) - annealed |
端子形式: | GULL WING | 端子节距: | 0.65 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | 40 |
宽度: | 5.3 mm | uPs/uCs/外围集成电路类型: | MICROCONTROLLER |
Base Number Matches: | 1 |
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