是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | DFN |
包装说明: | HVSON, SOLCC8,.15,32 | 针数: | 8 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.31.00.01 | Factory Lead Time: | 29 weeks |
风险等级: | 0.81 | 具有ADC: | YES |
其他特性: | CAN ALSO OPERATE AT 4MHZ AT 2VMIN SUPPLY AND 10MHZ AT 3V MIN SUPPLY | 地址总线宽度: | |
位大小: | 8 | 边界扫描: | NO |
CPU系列: | PIC | 最大时钟频率: | 20 MHz |
DAC 通道: | NO | DMA 通道: | NO |
外部数据总线宽度: | 格式: | FLOATING-POINT | |
集成缓存: | NO | JESD-30 代码: | S-PDSO-N8 |
JESD-609代码: | e3 | 长度: | 4 mm |
低功率模式: | NO | 湿度敏感等级: | 1 |
外部中断装置数量: | 1 | I/O 线路数量: | 6 |
端子数量: | 8 | 计时器数量: | 2 |
片上数据RAM宽度: | 8 | 片上程序ROM宽度: | 14 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
PWM 通道: | NO | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | HVSON | 封装等效代码: | SOLCC8,.15,32 |
封装形状: | SQUARE | 封装形式: | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度): | 260 | 电源: | 2.5/5 V |
认证状态: | Not Qualified | RAM(字节): | 64 |
ROM(单词): | 1024 | ROM可编程性: | FLASH |
筛选级别: | TS 16949 | 座面最大高度: | 1 mm |
速度: | 20 MHz | 子类别: | Microcontrollers |
最大压摆率: | 3 mA | 最大供电电压: | 5.5 V |
最小供电电压: | 4.5 V | 标称供电电压: | 5 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子面层: | Matte Tin (Sn) |
端子形式: | NO LEAD | 端子节距: | 0.8 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | 40 |
宽度: | 4 mm | uPs/uCs/外围集成电路类型: | MICROCONTROLLER, RISC |
Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
PIC12F675-E/SN | MICROCHIP |
类似代替 |
8-Pin, Flash-Based 8-Bit CMOS Microcontrollers | |
PIC12F675-I/SN | MICROCHIP |
类似代替 |
8-Pin, Flash-Based 8-Bit CMOS Microcontrollers | |
PIC12F675-I/P | MICROCHIP |
类似代替 |
8-Pin, Flash-Based 8-Bit CMOS Microcontrollers |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
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暂无描述 | |
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