是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | SOIC |
包装说明: | 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 | 针数: | 8 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.31.00.01 | Factory Lead Time: | 7 weeks |
风险等级: | 0.79 | Samacsys Confidence: | 3 |
Samacsys Status: | Released | Samacsys PartID: | 231581 |
Samacsys Pin Count: | 8 | Samacsys Part Category: | Integrated Circuit |
Samacsys Package Category: | Small Outline Packages | Samacsys Footprint Name: | soic 8 |
Samacsys Released Date: | 2015-10-26 07:44:52 | Is Samacsys: | N |
具有ADC: | YES | 其他特性: | CAN ALSO OPERATE AT 2V MIN SUPPLY |
地址总线宽度: | 位大小: | 8 | |
CPU系列: | PIC | 最大时钟频率: | 20 MHz |
DAC 通道: | NO | DMA 通道: | NO |
外部数据总线宽度: | JESD-30 代码: | R-PDSO-G8 | |
JESD-609代码: | e3 | 长度: | 4.9 mm |
湿度敏感等级: | 1 | I/O 线路数量: | 6 |
端子数量: | 8 | 片上程序ROM宽度: | 14 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
PWM 通道: | NO | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | SOP | 封装等效代码: | SOP8,.25 |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE |
峰值回流温度(摄氏度): | 260 | 电源: | 2/5 V |
认证状态: | Not Qualified | RAM(字节): | 64 |
ROM(单词): | 1024 | ROM可编程性: | FLASH |
座面最大高度: | 1.75 mm | 速度: | 20 MHz |
子类别: | Microcontrollers | 最大压摆率: | 15 mA |
最大供电电压: | 5.5 V | 最小供电电压: | 4.5 V |
标称供电电压: | 5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | Matte Tin (Sn) - annealed | 端子形式: | GULL WING |
端子节距: | 1.27 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | 40 | 宽度: | 3.9 mm |
uPs/uCs/外围集成电路类型: | MICROCONTROLLER, RISC | Base Number Matches: | 1 |
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