Heat Sinks
PCH Series
INTRODUCTION:
Solid State Relays (SSRs) generate heat while operating primarily from the semiconductor junction of the output switching device. This can be a triac, SCR or
Mosfet. When utilizing an SSR it is important that the heat generated be managed via the use of the proper heat sink or alternative cooling method. Proper
cooling will allow for maximum performance from the SSR. The use of the correct heat sink has a direct influence on the maximum load current that can be
switched and the maximum ambient temperature the SSR can operate in.
Proper installation of a heat sink is just as important for proper heat dissipation. This includes utilizing a thermal transfer pad or thermal conductive grease to
fill the gap between the relay and heat sink and utilizing the proper torque while tightening the screws attaching the SSR to the heat sink.
Recommended Screw Torque is 15 to20 in lbs or 1.7 to 2.2 Nm.
For very high performance applications, air cooling may be required in addition to the heat sink. Failure to manage the dissipation of heat by the SSR during
usage may lead to failure of the SSR in either a short or open output.
See page 3 for Heat Dissipation Calculations, Examples and Tables
E365647
Part Number
Dimensions (mm)
Thermal Resistance
Matching SSR
PCS15: 10 A, 15 A
PCH-I-50
50x50x50
2.4°C/W
PCS33: 30 VDC 50 A, 200 VDC 10 A
PCS15: 20 A, 25 A
PCH-H-110
PCH-H-150
64x110x118
1.1°C/W
PCS33: 400 VDC 10 A, 150 VDC 50 A,100 VDC 20 A,
50 VDC 40 A, 30 VDC 100 A
PCS15: 40 A
55x142x150
80x100x110
0.6°C/W
PCS33: 50 VDC 80 A, 100 VDC 40 A, 200 VDC 40 A
PCS34: 40 A, 50 A
PCH-IF-110
(Requires an additional
cooling fan)
PCH28: 40 A and Above
PCH34: 60 A and Above
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3220 Commander Drive, Suite 102 Carrollton, TX 75006
www.PickerComponents.com
Sales: (972) 713-6272
(888) 997-3933
Fax: (972)735-0964
e-mail: sales@pickercomponents.com
Dimensions are listed for reference purposes only.
PCS86 6/05/15
Specifications and Availability subject to change without notice.
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