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PCA8576F PDF预览

PCA8576F

更新时间: 2024-11-13 02:57:23
品牌 Logo 应用领域
恩智浦 - NXP /
页数 文件大小 规格书
54页 428K
描述
Automotive 40 × 4 LCD driver

PCA8576F 数据手册

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PCA8576F  
Automotive 40 × 4 LCD driver  
Rev. 3 — 3 December 2014  
Product data sheet  
1. General description  
The PCA8576F is a peripheral device which interfaces to almost any Liquid Crystal  
Display (LCD)1 with low multiplex rates. It generates the drive signals for any static or  
multiplexed LCD containing up to four backplanes and up to 40 segments. It can be easily  
cascaded for larger LCD applications. The PCA8576F is compatible with most  
microcontrollers and communicates via the two-line bidirectional I2C-bus. Communication  
overheads are minimized by a display RAM with auto-incremented addressing, by  
hardware subaddressing and by display memory switching (static and duplex drive  
modes).  
For a selection of NXP LCD segment drivers, see Table 28 on page 46.  
2. Features and benefits  
AEC-Q100 grade 2 compliant for automotive applications  
Single chip LCD controller and driver  
Selectable backplane drive configuration: static or 2, 3, 4 backplane multiplexing  
Selectable display bias configuration: static, 12, or 13  
Internal LCD bias generation with voltage-follower buffers  
40 segment drives:  
Up to 20 7-segment numeric characters  
Up to 10 14-segment alphanumeric characters  
Any graphics of up to 160 segments/elements  
40 4-bit RAM for display data storage  
Auto-incremented display data loading across device subaddress boundaries  
Display memory bank switching in static and duplex drive modes  
Versatile blinking modes  
Independent supplies possible for LCD and logic voltages  
Wide power supply range: from 1.8 V to 5.5 V  
Wide LCD supply range:  
From 2.5 V for low-threshold LCDs  
Up to 8.0 V for high-threshold twisted nematic LCDs  
Low power consumption  
400 kHz I2C-bus interface  
May be cascaded for large LCD applications (up to 1280 segments/elements possible)  
No external components required  
Compatible with chip-on-glass and chip-on-board technology  
1. The definition of the abbreviations and acronyms used in this data sheet can be found in Section 19.  

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