Datasheet > PCA8576F

PCA8576F

更新时间： 2022-10-12 15:08:01

品牌	Logo	应用领域
恩智浦 - NXP		/
页数	文件大小	规格书
54页	428K
描述
Automotive 40 × 4 LCD driver

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PCA8576F 数据手册

PCA8576F

Automotive 40 × 4 LCD driver

Rev. 3 — 3 December 2014

Product data sheet

1. General description

The PCA8576F is a peripheral device which interfaces to almost any Liquid Crystal

Display (LCD)¹with low multiplex rates. It generates the drive signals for any static or

multiplexed LCD containing up to four backplanes and up to 40 segments. It can be easily

cascaded for larger LCD applications. The PCA8576F is compatible with most

microcontrollers and communicates via the two-line bidirectional I²C-bus. Communication

overheads are minimized by a display RAM with auto-incremented addressing, by

hardware subaddressing and by display memory switching (static and duplex drive

modes).

For a selection of NXP LCD segment drivers, see Table 28 on page 46.

2. Features and benefits

 AEC-Q100 grade 2 compliant for automotive applications

 Single chip LCD controller and driver

 Selectable backplane drive configuration: static or 2, 3, 4 backplane multiplexing

 Selectable display bias configuration: static, ¹⁄₂, or ¹⁄₃

 Internal LCD bias generation with voltage-follower buffers

 40 segment drives:

 Up to 20 7-segment numeric characters

 Up to 10 14-segment alphanumeric characters

 Any graphics of up to 160 segments/elements

 40  4-bit RAM for display data storage

 Auto-incremented display data loading across device subaddress boundaries

 Display memory bank switching in static and duplex drive modes

 Versatile blinking modes

 Independent supplies possible for LCD and logic voltages

 Wide power supply range: from 1.8 V to 5.5 V

 Wide LCD supply range:

 From 2.5 V for low-threshold LCDs

 Up to 8.0 V for high-threshold twisted nematic LCDs

 Low power consumption

 400 kHz I²C-bus interface

 May be cascaded for large LCD applications (up to 1280 segments/elements possible)

 No external components required

 Compatible with chip-on-glass and chip-on-board technology

1. The definition of the abbreviations and acronyms used in this data sheet can be found in Section 19.

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