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PC16550DVX PDF预览

PC16550DVX

更新时间： 2024-11-21 04:11:11
品牌 Logo 应用领域
美国国家半导体 - NSC 外围集成电路数据传输通信时钟
页数 文件大小 规格书
3页 84K
描述
Engineering Project Manager

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中文翻译

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PC16550DVX 技术参数

是否Rohs认证： 不符合生命周期：Transferred
包装说明：QCCJ, LDCC44,.7SQReach Compliance Code：not_compliant
ECCN代码：EAR99HTS代码：8542.39.00.01
风险等级：5.2地址总线宽度：3
边界扫描：NO总线兼容性：8088
最大时钟频率：24 MHz通信协议：ASYNC, BIT
数据编码/解码方法：NRZ最大数据传输速率：0.1875 MBps
外部数据总线宽度：8JESD-30 代码：S-PQCC-J44
JESD-609代码：e0长度：16.51 mm
低功率模式：NO湿度敏感等级：2A
DMA 通道数量：I/O 线路数量：
串行 I/O 数：1端子数量：44
片上数据RAM宽度：最高工作温度：70 °C
最低工作温度：封装主体材料：PLASTIC/EPOXY
封装代码：QCCJ封装等效代码：LDCC44,.7SQ
封装形状：SQUARE封装形式：CHIP CARRIER
峰值回流温度（摄氏度）：220电源：5 V
认证状态：Not QualifiedRAM（字数）：0
座面最大高度：4.57 mm子类别：Serial IO/Communication Controllers
最大压摆率：15 mA最大供电电压：5.5 V
最小供电电压：4.5 V标称供电电压：5 V
表面贴装：YES技术：CMOS
温度等级：COMMERCIAL端子面层：Tin/Lead (Sn/Pb)
端子形式：J BEND端子节距：1.27 mm
端子位置：QUAD处于峰值回流温度下的最长时间：30
宽度：16.51 mmuPs/uCs/外围集成电路类型：SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches：1

PC16550DVX 数据手册

 浏览型号PC16550DVX的Datasheet PDF文件第2页浏览型号PC16550DVX的Datasheet PDF文件第3页 
Company  
URL for Additional Information  
National Semiconductor  
http://www.national.com/quality/green/  
Contact  
Title  
Phone  
Email  
Engineering Project Manager  
Green.project@nsc.com  
Gloria Gordon  
1-408-721-8435  
Part Number  
MSL Rating  
Peak Body Temp C  
MaxTime (Sec)  
Cycles  
PC16550DVX  
2A  
220  
30  
4
Document Date  
Weight (mg)  
Unit Type  
Contains Lead(Pb) and is NOT European RoHS Compliant  
NOT China RoHS Compliant  
5-May-2007  
2,220.000  
Each  
Homogeneous Material Composition Declaration for Electronic Products  
Item  
Weight (mg)  
Component  
CAS#  
Weight (mg)  
1,190.610  
368.295  
Item-ppm  
Part-ppm  
536,311  
Plastic  
1,587.480 SiO2  
60676-86-0  
25928-94-3  
1309-64-4  
750,000  
Epoxy Resin  
Sb2O3  
232,000  
12,000  
6,000  
165,899  
8,581  
4,290  
253,844  
6,252  
313  
19.050  
Brominated Epoxy  
40039-93-8  
7440-50-8  
7439-89-6  
7440-66-6  
7723-14-0  
7440-31-5  
7439-92-1  
7440-21-3  
7429-90-5  
7440-57-5  
7440-22-4  
7440-22-4  
25928-94-3  
9.525  
563.534  
13.879  
0.694  
Leadframe  
578.280 Cu  
974,500  
24,000  
1,200  
Fe  
Zn  
P
0.173  
300  
78  
Ext. LeadFinish  
Chip  
39.780 Sn  
Pb  
33.813  
5.967  
850,000  
150,000  
994,000  
6,000  
15,231  
2,688  
4,433  
27  
9.900 Si  
Al  
9.841  
0.059  
Wires  
2.030 Au  
1.510 Ag  
1.020 Ag  
2.030  
1,000,000  
1,000,000  
750,000  
250,000  
914  
Int. LeadFinish  
Die Attach  
1.510  
680  
0.765  
345  
Epoxy Resin  
0.255  
115  
Note: The device content disclosed herewith is approximate and is based on engineering estimates only. It has not been verified through analytical testing.  
Additionally, the following should be noted:  
1. One or more dopant materials may be present in the silicon die at sub-ppm levels to provide semiconductor properties.  
2. Epoxy resin components listed are generic and may or may not be the specific compound used, which is considered proprietary.  
RoHS Material Composition Declaration  
RoHS Definition: Quantity limit of 0.1% by mass (1000 PPM) in homogeneous material for: Lead (Pb), Mercury, Hexavalent  
Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) and quantity limit of 0.01% by mass  
(100 PPM) of homogeneous material for Cadmium  
RoHS Directive  
2002/95/EC  
Subject to the limitations below, National Semiconductor Corporation (“National”) certifies the following information as of the document date.  
1. National products with lead-free solder comply with the European Union’s Directive on the Restriction of the Use of Hazardous Substances  
2002/95/EC (“RoHS”). These products do not contain homogeneous materials with Joint Industry Guide (JIG) -101 Level A materials above Level A  
threshold levels, except lead in RoHS exempt applications 5, 7a and 7c.  
2. National products with lead-containing solder do not comply with RoHS, because they contain lead in a non-exempt application. These products do  
not contain other RoHS restricted substances or homogeneous materials with JIG-101 Level A materials above Level A threshold levels, except lead in  
solder and RoHS exempt applications 5, 7a and 7c.  
3. National products are manufactured in conformance with National specifications (SC) CSP-9-111C1 Supplier Environmental Requirements for  
Materials and Products and (SC) CSP-9-111S2 National’s List of Banned and Reportable Substances, which are available at  
www.national.com/quality/green/.  
4. National products do not contain and are not manufactured with ozone depleting substances subject to The Montreal Protocol on Substances that  
Deplete the Ozone Layer and U.S. Clean Air Act, Title VI.  
National has taken commercially reasonable steps to provide representative and accurate information but may not have independently verified information  
provided by others or conducted testing or chemical analysis on incoming materials and chemicals. Information provided in this document is derived from  
default values associated with internal process information and may not be representative of all or actual materials used in the product (e.g. the default  
may indicate a particular material, while an equivalent compliant material from the same or alternate supplier was actually used). Material concentrations  
are the maximum expected concentration of the substances in the device and may not represent the actual concentration. National and National suppliers  
consider certain limited information to be confidential and thus CAS numbers and other limited information may not be available for release. National’s  
standard warranty and limitation of liability provisions of National’s Standard Terms and Conditions of Sale apply to any issues arising out of or in  
connection with the information provided herein unless otherwise provided by a written contract signed by both parties.  
NATIONAL ACCEPTS NO DUTY TO NOTIFY USERS OF THIS DECLARATION OF UPDATES OR CHANGES TO THIS DECLARATION.  
Gerry Fields  
Vice President Quality  
National Semiconductor  
Page 1 of 3  
123

中文翻译

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