是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | DFP |
包装说明: | DFP, | 针数: | 28 |
Reach Compliance Code: | compliant | ECCN代码: | 3A001.A.2.C |
HTS代码: | 8542.32.00.41 | 风险等级: | 5.12 |
最长访问时间: | 45 ns | JESD-30 代码: | R-GDFP-F28 |
内存密度: | 73728 bit | 内存集成电路类型: | STANDARD SRAM |
内存宽度: | 9 | 功能数量: | 1 |
端子数量: | 28 | 字数: | 8192 words |
字数代码: | 8000 | 工作模式: | ASYNCHRONOUS |
最高工作温度: | 125 °C | 最低工作温度: | -55 °C |
组织: | 8KX9 | 封装主体材料: | CERAMIC, GLASS-SEALED |
封装代码: | DFP | 封装形状: | RECTANGULAR |
封装形式: | FLATPACK | 并行/串行: | PARALLEL |
峰值回流温度(摄氏度): | NOT SPECIFIED | 认证状态: | Not Qualified |
筛选级别: | MIL-STD-883 Class B | 座面最大高度: | 2.286 mm |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 4.5 V |
标称供电电压 (Vsup): | 5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | MILITARY |
端子形式: | FLAT | 端子节距: | 1.27 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 9.017 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
P4C163L-45FMLF | PYRAMID |
获取价格 |
Standard SRAM, 8KX9, 45ns, CMOS, CDFP28, ROHS COMPLIANT, CERAMIC, DFP-28 | |
P4C163L-45LM | ETC |
获取价格 |
x9 SRAM | |
P4C163L-45LMBLF | PYRAMID |
获取价格 |
Standard SRAM, 8KX9, 45ns, CMOS, CQCC28, 0.350 X 0.550 INCH, ROHS COMPLIANT, CERAMIC, LCC- | |
P4C163L-45LMLF | PYRAMID |
获取价格 |
Standard SRAM, 8KX9, 45ns, CMOS, CQCC28, 0.350 X 0.550 INCH, ROHS COMPLIANT, CERAMIC, LCC- | |
P4C164 | PYRAMID |
获取价格 |
ULTRA HIGH SPEED 8K x 8 STATIC CMOS RAMS | |
P4C164-100CILF | PYRAMID |
获取价格 |
Standard SRAM, 8KX8, 100ns, CMOS, CDIP28, 0.300 INCH, ROHS COMPLIANT, CERAMIC, SIDE BRAZED | |
P4C164-100CMBLF | PYRAMID |
获取价格 |
Standard SRAM, 8KX8, 100ns, CMOS, CDIP28, 0.300 INCH, ROHS COMPLIANT, CERAMIC, SIDE BRAZED | |
P4C164-100CMLF | PYRAMID |
获取价格 |
Standard SRAM, 8KX8, 100ns, CMOS, CDIP28, 0.300 INCH, ROHS COMPLIANT, CERAMIC, SIDE BRAZED | |
P4C164-100CWCLF | PYRAMID |
获取价格 |
Standard SRAM, 8KX8, 100ns, CMOS, CDIP28, 0.600 INCH, ROHS COMPLIANT, CERAMIC, SIDE BRAZED | |
P4C164-100CWILF | PYRAMID |
获取价格 |
Standard SRAM, 8KX8, 100ns, CMOS, CDIP28, 0.600 INCH, ROHS COMPLIANT, CERAMIC, SIDE BRAZED |