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NX25P20-VNI-T PDF预览

NX25P20-VNI-T

更新时间: 2024-09-27 18:44:03
品牌 Logo 应用领域
华邦 - WINBOND 时钟光电二极管内存集成电路
页数 文件大小 规格书
28页 523K
描述
Flash, 256KX8, PDSO8

NX25P20-VNI-T 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
Reach Compliance Code:not_compliant风险等级:5.88
最大时钟频率 (fCLK):40 MHz数据保留时间-最小值:20
耐久性:100000 Write/Erase CyclesJESD-30 代码:R-PDSO-G8
内存密度:2097152 bit内存集成电路类型:FLASH
内存宽度:8端子数量:8
字数:262144 words字数代码:256000
最高工作温度:85 °C最低工作温度:-40 °C
组织:256KX8封装主体材料:PLASTIC/EPOXY
封装代码:SOP封装等效代码:SOP8,.25
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
并行/串行:SERIAL电源:3/3.3 V
认证状态:Not Qualified串行总线类型:SPI
最大待机电流:0.000005 A子类别:Flash Memories
最大压摆率:0.018 mA表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:GULL WING端子节距:1.27 mm
端子位置:DUAL类型:NOR TYPE
写保护:HARDWARE/SOFTWAREBase Number Matches:1

NX25P20-VNI-T 数据手册

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PRELIMINARY  
JUNE2005  
NX25P10, NX25P20 AND NX25P40  
1M-BIT, 2M-BIT AND 4M-BIT  
Serial Flash Memory with 40MHz SPI  
inbond  
Electronics Corp.  
June 23, 2005  
On June 23, 2005 Winbond Electronics Corporation acquired NexFlash Technologies, Inc. The  
following document specifies a Winbond spiFlash™ memory product. Although the document is  
marked with the NexFlash name these products are offered to Winbond customers.  
Continuity  
There is no change to this data sheet as a result of offering the device as a Winbond product. Any  
changes that have been made are the result of normal data sheet improvements and are noted in  
the document revision history.  
Continuity of Ordering Part Numbers  
Winbond will continue to support the existing NexFlash part numbers beginning with the NX  
prefix. Please see the ordering information in this document for further information.  
For more information  
Please contact your local Winbond sales office or email us at  
products@nexflash.com  
spiflash_products@winbond.com.  
NexFlashTechnologies, Inc.  
1
PRELIMINARY MKP-0009 Rev 8 NXSF040K-0605  
06/14/05 ©  

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