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NX25P32-VFI-GT PDF预览

NX25P32-VFI-GT

更新时间: 2024-11-02 19:58:43
品牌 Logo 应用领域
华邦 - WINBOND 光电二极管
页数 文件大小 规格书
34页 607K
描述
Flash, 4MX8, PDSO16,

NX25P32-VFI-GT 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:SOP, SOP16,.4Reach Compliance Code:compliant
风险等级:5.8最大时钟频率 (fCLK):50 MHz
数据保留时间-最小值:20耐久性:100000 Write/Erase Cycles
JESD-30 代码:R-PDSO-G16内存密度:33554432 bit
内存集成电路类型:FLASH内存宽度:8
端子数量:16字数:4194304 words
字数代码:4000000最高工作温度:85 °C
最低工作温度:-40 °C组织:4MX8
封装主体材料:PLASTIC/EPOXY封装代码:SOP
封装等效代码:SOP16,.4封装形状:RECTANGULAR
封装形式:SMALL OUTLINE并行/串行:SERIAL
电源:3/3.3 V认证状态:Not Qualified
串行总线类型:SPI最大待机电流:0.000005 A
子类别:Flash Memories最大压摆率:0.02 mA
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子形式:GULL WING
端子节距:1.27 mm端子位置:DUAL
类型:NOR TYPE写保护:HARDWARE/SOFTWARE
Base Number Matches:1

NX25P32-VFI-GT 数据手册

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PRELIMINARY  
JUNE2005  
NX25P80, NX25P16 AND NX25P32  
8M-BIT, 16M-BIT AND 32M-BIT  
Serial Flash Memory  
inbond  
Electronics Corp.  
June 23, 2005  
On June 23, 2005 Winbond Electronics Corporation acquired NexFlash Technologies, Inc. The  
following document specifies a Winbond spiFlash™ memory product. Although the document is  
marked with the NexFlash name these products are offered to Winbond customers.  
Continuity  
There is no change to this data sheet as a result of offering the device as a Winbond product. Any  
changes that have been made are the result of normal data sheet improvements and are noted in  
the document revision history.  
Continuity of Ordering Part Numbers  
Winbond will continue to support the existing NexFlash part numbers beginning with the NX  
prefix. Please see the ordering information in this document for further information.  
For more information  
Please contact your local Winbond sales office or email us at  
products@nexflash.com  
spiflash_products@winbond.com.  
NexFlashTechnologies, Inc.  
1
PRELIMINARYMKP-0010Rev6 NXSF044H-0605  
06/14/05 ©  

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