NVMJST1D3N04C
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise specified)
J
Parameter
OFF CHARACTERISTICS
Symbol
Test Condition
Min
Typ
Max
Unit
Drain−to−Source Breakdown Voltage
V
V
GS
= 0 V, I = 250 mA
40
V
(BR)DSS
D
Drain−to−Source Breakdown Voltage
Temperature Coefficient
V
/
9.6
mV/°C
(BR)DSS
T
J
Zero Gate Voltage Drain Current
I
V
= 0 V,
T = 25°C
10
mA
DSS
GS
DS
J
V
= 40 V
T = 125°C
J
100
100
Gate−to−Source Leakage Current
ON CHARACTERISTICS (Note 4)
Gate Threshold Voltage
Threshold Temperature Coefficient
Drain−to−Source On Resistance
Forward Transconductance
CHARGES AND CAPACITANCES
Input Capacitance
I
V
= 0 V, V = 20 V
nA
GSS
DS
GS
V
V
= V , I = 170 mA
2.5
3.5
V
mV/°C
mW
S
GS(TH)
GS
DS
D
V
/T
J
−8.6
1.2
GS(TH)
R
V
GS
= 10 V
I = 50 A
D
1.39
DS(on)
g
V
=15 V, I = 50 A
145
FS
DS
D
C
4300
2100
59
pF
nC
ISS
Output Capacitance
C
C
V
= 0 V, f = 1 MHz, V = 25 V
DS
OSS
RSS
GS
Reverse Transfer Capacitance
Total Gate Charge
Q
V
= 10 V, V = 20 V; I = 50 A
65
G(TOT)
GS
DS
D
Threshold Gate Charge
Q
13
G(TH)
Gate−to−Source Charge
Gate−to−Drain Charge
Q
20
GS
GD
GP
V
GS
= 10 V, V = 20 V; I = 50 A
DS
D
Q
V
12
Plateau Voltage
4.7
V
SWITCHING CHARACTERISTICS (Note 5)
Turn−On Delay Time
t
15
47
36
9.0
ns
d(ON)
Rise Time
t
r
V
= 10 V, V = 20 V,
DS
GS
D
I
= 50 A, R = 2.5 W
G
Turn−Off Delay Time
t
d(OFF)
Fall Time
t
f
DRAIN−SOURCE DIODE CHARACTERISTICS
Forward Diode Voltage
V
T = 25°C
0.82
0.68
63
1.2
V
SD
J
V
S
= 0 V,
GS
I
= 50 A
T = 125°C
J
Reverse Recovery Time
Charge Time
t
ns
RR
t
t
34
a
V
= 0 V, dIS/dt = 100 A/ms,
GS
I
S
= 50 A
Discharge Time
29
b
Reverse Recovery Charge
Q
92
nC
RR
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. Pulse Test: pulse width v 300 ms, duty cycle v 2%.
5. Switching characteristics are independent of operating junction temperatures.
www.onsemi.com
2