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NVMJST1D2N04CTXG PDF预览

NVMJST1D2N04CTXG

更新时间: 2023-09-03 20:29:32
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
7页 322K
描述
Single N-Channel Power MOSFET 40V, 268A, 1.2 mΩ on Top Cool Package

NVMJST1D2N04CTXG 数据手册

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DATA SHEET  
www.onsemi.com  
MOSFET – Power, Single  
N-Channel  
40 V, 1.25 mW, 451 A  
V
R
MAX  
I
MAX  
(BR)DSS  
DS(ON)  
D
40 V  
1.25 mW @ 10 V  
451 A  
D (6,7,8,9,10,TOP)  
NVMJST1D2N04C  
Features  
Small Footprint (5x7 mm) for Compact Design  
G (1)  
Low R  
to Minimize Conduction Losses  
DS(on)  
Low Q and Capacitance to Minimize Driver Losses  
G
S (2,3,4,5)  
TCPAK57 5x7 Top Cool Package  
NCHANNEL MOSFET  
AECQ101 Qualified and PPAP Capable  
These Devices are PbFree and are RoHS Compliant  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Parameter  
DraintoSource Voltage  
Symbol  
Value  
40  
Unit  
V
V
DSS  
GatetoSource Voltage  
V
20  
V
GS  
TCPAK57  
CASE 760AG  
Continuous Drain  
Current R  
T
= 25°C  
= 100°C  
= 25°C  
I
451  
319  
454  
227  
900  
A
C
D
q
JC  
T
C
(Notes 1, 3)  
Steady  
State  
MARKING DIAGRAM  
Power Dissipation  
T
C
P
W
D
R
(Note 1)  
q
JC  
T
C
= 100°C  
Pulsed Drain Current  
T = 25°C, t = 10 ms  
I
DM  
A
A
p
Operating Junction and Storage Temperature  
Range  
T , T  
55 to  
+175  
°C  
J
stg  
Source Current (Body Diode)  
I
S
379  
A
Single Pulse DraintoSource Avalanche  
E
AS  
1541  
mJ  
Energy (I  
= 24 A)  
L(pk)  
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
L
260  
°C  
XXXX = Specific Device Code  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
A
Y
= Assembly Location  
= Year  
W
ZZ  
= Work Week  
= Assembly Lot Code  
THERMAL RESISTANCE MAXIMUM RATINGS  
Parameter  
Symbol  
Value  
0.33  
29  
Unit  
JunctiontoCase Steady State  
JunctiontoAmbient Steady State (Note 2)  
JunctiontoDrain Lead  
R
°C/W  
q
JC  
ORDERING INFORMATION  
See detailed ordering, marking and shipping information in the  
package dimensions section on page 5 of this data sheet.  
R
q
JA  
Y
5.2  
JL  
JL  
JH  
JunctiontoSource Lead  
Y
5.16  
1.5  
JunctiontoHeatsink Top (Note 2)  
Y
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
2. 2s2p JEDEC517 standard PCB mounted to a 25x25x3 (mm) aluminum  
heatsink with a 12 w/mK TIM interface.  
3. Maximum current for pulses as long as 1 second is higher but is dependent  
on pulse duration and duty cycle.  
© Semiconductor Components Industries, LLC, 2020  
1
Publication Order Number:  
September, 2022 Rev. 0  
NVMJST1D2N04C/D  
 

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