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NVMJST1D3N04CTXG PDF预览

NVMJST1D3N04CTXG

更新时间: 2023-09-03 20:30:07
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
7页 314K
描述
Single N-Channel Power MOSFET, 40 V, 1.35 mΩ on Top Cool Package 

NVMJST1D3N04CTXG 数据手册

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DATA SHEET  
www.onsemi.com  
MOSFET – Power, Single  
N-Channel  
40 V, 1.39 mW, 386 A  
V
R
MAX  
I
MAX  
(BR)DSS  
DS(ON)  
D
40 V  
1.39 mW @ 10 V  
386 A  
D (6,7,8,9,10,TOP)  
NVMJST1D3N04C  
Features  
Small Footprint (5x7 mm) for Compact Design  
G (1)  
Low R  
to Minimize Conduction Losses  
DS(on)  
Low Q and Capacitance to Minimize Driver Losses  
G
S (2,3,4,5)  
TCPAK57 5x7 Top Cool Package  
NCHANNEL MOSFET  
AECQ101 Qualified and PPAP Capable  
These Devices are PbFree and are RoHS Compliant  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Parameter  
DraintoSource Voltage  
Symbol  
Value  
40  
Unit  
V
V
DSS  
GatetoSource Voltage  
V
GS  
20  
V
Continuous Drain  
Current R  
T
= 25°C  
= 100°C  
= 25°C  
I
386  
273  
375  
187  
900  
A
C
D
TCPAK57  
CASE 760AG  
q
JC  
T
C
(Notes 1, 3)  
Steady  
State  
Power Dissipation  
T
C
P
W
D
R
(Note 1)  
q
JC  
T
C
= 100°C  
MARKING DIAGRAM  
Pulsed Drain Current  
T = 25°C, t = 10 ms  
I
DM  
A
A
p
Operating Junction and Storage Temperature  
Range  
T , T  
55 to  
+175  
°C  
J
stg  
Source Current (Body Diode)  
I
312  
739  
A
S
Single Pulse DraintoSource Avalanche  
E
AS  
mJ  
Energy (I  
= 19 A)  
L(pk)  
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
L
260  
°C  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
XXXX  
A
Y
= Specific Device Code  
= Assembly Location  
= Year  
THERMAL RESISTANCE MAXIMUM RATINGS  
W
= Work Week  
ZZ  
= Assembly Lot  
Parameter  
Symbol  
Value  
0.4  
Unit  
JunctiontoCase Steady State  
JunctiontoAmbient Steady State (Note 2)  
JunctiontoHeatsink Top (Note 2)  
JunctiontoDrain Lead  
R
°C/W  
q
JC  
R
29.2  
1.67  
5.4  
q
JA  
ORDERING INFORMATION  
See detailed ordering, marking and shipping information in the  
package dimensions section on page 5 of this data sheet.  
Y
JH  
Y
JL  
Y
JL  
JunctiontoSource Lead  
5.3  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
2. 2s2p JEDEC517 standard PCB mounted to a 25x25x3 (mm) aluminum  
heatsink with a 12 w/mK TIM interface.  
3. Maximum current for pulses as long as 1 second is higher but is dependent  
on pulse duration and duty cycle.  
© Semiconductor Components Industries, LLC, 2021  
1
Publication Order Number:  
September, 2022 Rev. 3  
NVMJST1D3N04C/D  
 

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