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NVD2955

更新时间: 2024-09-24 12:05:47
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
8页 124K
描述
−60 V, −12 A, P−Channel DPAK

NVD2955 数据手册

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NTD2955, NTD2955P,  
NVD2955  
Power MOSFET  
60 V, 12 A, PChannel DPAK  
This Power MOSFET is designed to withstand high energy in the  
avalanche and commutation modes. Designed for lowvoltage, high−  
speed switching applications in power supplies, converters, and power  
motor controls. These devices are particularly well suited for bridge  
circuits where diode speed and commutating safe operating areas are  
critical and offer an additional safety margin against unexpected  
voltage transients.  
http://onsemi.com  
V
R
TYP  
I MAX  
D
(BR)DSS  
DS(on)  
60 V  
155 mW @ 10 V, 6 A  
12 A  
PChannel  
D
Features  
Avalanche Energy Specified  
I  
and V  
Specified at Elevated Temperature  
DSS  
DS(on)  
Designed for LowVoltage, HighSpeed Switching Applications and  
to Withstand High Energy in the Avalanche and Commutation Modes  
NVD Prefix for Automotive and Other Applications Requiring  
Unique Site and Control Change Requirements; AECQ101  
Qualified and PPAP Capable  
G
S
MARKING DIAGRAMS  
These Devices are PbFree and are RoHS Compliant  
4
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
4
4
Rating  
Symbol  
Value  
Unit  
2
1
Drain  
Drain  
3
DraintoSource Voltage  
V
DSS  
60  
Vdc  
DPAK  
CASE 369C  
STYLE 2  
GatetoSource Voltage  
Continuous  
V
GSM  
20  
25  
Vdc  
Vpk  
GS  
V
Nonrepetitive (t 10 ms)  
p
Drain Current  
Drain Current Continuous @ T = 25°C  
Drain Current Single Pulse (t 10 ms)  
I
12  
18  
Adc  
Apk  
2
2
D
a
1
Gate  
1
Gate  
3
3
I
Drain  
Drain  
DM  
p
Source  
Source  
Total Power Dissipation @ T = 25°C  
P
55  
W
a
D
4
Operating and Storage Temperature  
Range  
T , T  
55 to  
175  
°C  
J
stg  
4
Drain  
Single Pulse DraintoSource Avalanche  
E
AS  
216  
mJ  
Energy Starting T = 25°C  
J
(V = 25 Vdc, V = 10 Vdc, Peak  
DD  
GS  
I = 12 Apk, L = 3.0 mH, R = 25 W)  
1
L
G
2
3
Thermal Resistance  
R
R
2.73  
71.4  
100  
°C/W  
°C  
JunctiontoCase  
JunctiontoAmbient (Note 1)  
JunctiontoAmbient (Note 2)  
q
JC  
JA  
JA  
DPAK3  
CASE 369D  
STYLE 2  
q
1
2
3
R
q
Gate Drain Source  
Maximum Lead Temperature for Soldering  
Purposes, 1/8 in. from case for  
10 seconds  
T
260  
L
Y
= Year  
WW = Work Week  
= PbFree Package  
G
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 6 of this data sheet.  
1. When surface mounted to an FR4 board using 1 in pad size  
2
(Cu area = 1.127 in ).  
2. When surface mounted to an FR4 board using the minimum recommended  
2
pad size (Cu area = 0.412 in ).  
© Semiconductor Components Industries, LLC, 2012  
1
Publication Order Number:  
October, 2012 Rev. 12  
NTD2955/D  
 

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