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NUP4114HMR6_11 PDF预览

NUP4114HMR6_11

更新时间: 2024-11-23 10:30:11
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
9页 159K
描述
Transient Voltage Suppressors

NUP4114HMR6_11 数据手册

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NUP4114HMR6  
Transient Voltage  
Suppressors  
Low Capacitance ESD Protection for  
High Speed Data Lines  
http://onsemi.com  
The NUP4114HMR6 transient voltage suppressor is designed to  
protect high speed data lines from ESD. Ultralow capacitance and  
high level of ESD protection makes this device well suited for use in  
HDMI and DVI applications.  
MARKING  
DIAGRAM  
6
TSOP6  
CASE 318G  
STYLE 12  
1
Features  
P4H MG  
1
G
Low Capacitance (0.8 pF Typical Between I/O Lines)  
Low Clamping Voltage  
Low Leakage  
P4H = Specific Device Code  
M
G
= Date Code  
= PbFree Package  
(Note: Microdot may be in either location)  
Stand Off Voltage: 5 V  
Protection for the Following IEC Standards:  
IEC 6100042 Level 4 ESD Protection  
UL Flammability Rating of 94 V0  
This is a PbFree Device  
PIN CONFIGURATION  
AND SCHEMATIC  
Typical Applications  
High Speed Communication Line Protection  
Digital Video Interface (DVI) and HDMI  
Monitors and Flat Panel Displays  
Gigabit Ethernet  
I/O 1  
6 I/O  
V
N
2
5 V  
P
Notebook Computers  
I/O 3  
4 I/O  
USB 2.0 High Speed Data Line and Power Line Protection  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Rating  
Symbol  
Value  
40 to +125  
55 to +150  
260  
Unit  
°C  
ORDERING INFORMATION  
Operating Junction Temperature Range  
Storage Temperature Range  
T
J
Device  
Package  
Shipping  
T
stg  
°C  
NUP4114HMR6T1G TSOP6 3000/Tape & Reel  
(PbFree)  
Lead Solder Temperature −  
Maximum (10 Seconds)  
T
L
°C  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
Human Body Model (HBM)  
Machine Model (MM)  
IEC 6100042 Contact (ESD)  
ESD  
16000  
400  
13000  
V
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
See Application Note AND8308/D for further description of  
survivability specs.  
© Semiconductor Components Industries, LLC, 2011  
1
Publication Order Number:  
May, 2011 Rev. 4  
NUP4114HMR6/D  

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