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NTNS3164NZ PDF预览

NTNS3164NZ

更新时间: 2024-10-02 12:01:19
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
6页 125K
描述
Small Signal MOSFET 20 V, 361 mA, Single N.Channel, SOT.883 (XDFN3) 1.0 x 0.6 x 0.4 mm Package

NTNS3164NZ 数据手册

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NTNS3164NZ  
Small Signal MOSFET  
20 V, 361 mA, Single NChannel, SOT883  
(XDFN3) 1.0 x 0.6 x 0.4 mm Package  
Features  
http://onsemi.com  
Single NChannel MOSFET  
Ultra Low Profile SOT883 (XDFN3) 1.0 x 0.6 x 0.4 mm for  
V
R
MAX  
I Max  
D
(BR)DSS  
DS(on)  
Extremely Thin Environments Such as Portable Electronics  
0.7 W @ 4.5 V  
Low R  
Solution in the Ultra Small 1.0 x 0.6 mm Package  
1.5 V Gate Drive  
DS(on)  
1.0 W @ 2.5 V  
2.0 W @ 1.8 V  
361 mA  
20 V  
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
Compliant  
4.0 W @ 1.5 V  
Applications  
High Side Switch  
High Speed Interfacing  
Level Shift and Translate  
Optimized for Power Management in Ultra Portable Solutions  
NCHANNEL MOSFET  
D (3)  
MAXIMUM RATINGS (T = 25°C unless otherwise stated)  
J
Parameter  
DraintoSource Voltage  
GatetoSource Voltage  
Symbol  
Value  
20  
Unit  
V
G (1)  
V
DSS  
V
GS  
8
V
Continuous Drain  
Current (Note 1)  
Steady  
T = 25°C  
I
361  
260  
427  
155  
mA  
A
D
State  
T = 85°C  
A
t 5 s  
T = 25°C  
A
S (2)  
Power Dissipation  
(Note 1)  
Steady  
State  
T = 25°C  
A
P
mW  
D
t 5 s  
217  
MARKING DIAGRAM  
3
Pulsed Drain  
Current  
t = 10 ms  
p
I
1082  
mA  
DM  
1
64 M  
2
Operating Junction and Storage  
Temperature  
T , T  
55 to  
150  
°C  
J
STG  
SOT883 (XDFN3)  
CASE 506CB  
Source Current (Body Diode) (Note 2)  
I
129  
260  
mA  
S
64  
M
= Specific Device Code  
= Date Code  
Lead Temperature for Soldering Purposes  
(1/8” from case for 10 s)  
T
°C  
L
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
ORDERING INFORMATION  
1. Surfacemounted on FR4 board using the minimum recommended pad size,  
Device  
Package  
Shipping  
2
or 2 mm , 1 oz Cu.  
2. Pulse Test: pulse width 300 ms, duty cycle 2%  
NTNS3164NZT5G SOT883  
(PbFree)  
8000 / Tape &  
Reel  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
© Semiconductor Components Industries, LLC, 2013  
1
Publication Order Number:  
March, 2013 Rev. 0  
NTNS3164NZ/D  
 

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