NTNS3164NZ
Small Signal MOSFET
20 V, 361 mA, Single N−Channel, SOT−883
(XDFN3) 1.0 x 0.6 x 0.4 mm Package
Features
http://onsemi.com
• Single N−Channel MOSFET
• Ultra Low Profile SOT−883 (XDFN3) 1.0 x 0.6 x 0.4 mm for
V
R
MAX
I Max
D
(BR)DSS
DS(on)
Extremely Thin Environments Such as Portable Electronics
0.7 W @ 4.5 V
• Low R
Solution in the Ultra Small 1.0 x 0.6 mm Package
• 1.5 V Gate Drive
DS(on)
1.0 W @ 2.5 V
2.0 W @ 1.8 V
361 mA
20 V
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
4.0 W @ 1.5 V
Applications
• High Side Switch
• High Speed Interfacing
• Level Shift and Translate
• Optimized for Power Management in Ultra Portable Solutions
N−CHANNEL MOSFET
D (3)
MAXIMUM RATINGS (T = 25°C unless otherwise stated)
J
Parameter
Drain−to−Source Voltage
Gate−to−Source Voltage
Symbol
Value
20
Unit
V
G (1)
V
DSS
V
GS
8
V
Continuous Drain
Current (Note 1)
Steady
T = 25°C
I
361
260
427
155
mA
A
D
State
T = 85°C
A
t ≤ 5 s
T = 25°C
A
S (2)
Power Dissipation
(Note 1)
Steady
State
T = 25°C
A
P
mW
D
t ≤ 5 s
217
MARKING DIAGRAM
3
Pulsed Drain
Current
t = 10 ms
p
I
1082
mA
DM
1
64 M
2
Operating Junction and Storage
Temperature
T , T
−55 to
150
°C
J
STG
SOT−883 (XDFN3)
CASE 506CB
Source Current (Body Diode) (Note 2)
I
129
260
mA
S
64
M
= Specific Device Code
= Date Code
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
T
°C
L
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
ORDERING INFORMATION
1. Surface−mounted on FR4 board using the minimum recommended pad size,
†
Device
Package
Shipping
2
or 2 mm , 1 oz Cu.
2. Pulse Test: pulse width ≤ 300 ms, duty cycle ≤ 2%
NTNS3164NZT5G SOT−883
(Pb−Free)
8000 / Tape &
Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2013
1
Publication Order Number:
March, 2013 − Rev. 0
NTNS3164NZ/D