Datasheet > NTNS3A91PZT5G

NTNS3A91PZT5G

更新时间： 2024-10-02 12:22:51

品牌	Logo	应用领域
安森美 - ONSEMI		/
页数	文件大小	规格书
3页	99K
描述
Small Signal MOSFET .20 V, .214 mA, Single P.Channel, 0.62 x 0.62 x 0.4 mm XLLGA3 Package

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NTNS3A91PZT5G 数据手册

NTNS3A91PZ

Advance Information

Small Signal MOSFET

−20 V, −214 mA, Single P−Channel,

0.62 x 0.62 x 0.4 mm XLLGA3 Package

Features

http://onsemi.com

MOSFET

• Single P−Channel MOSFET

• Ultra Small and Thin Package (0.62 x 0.62 x 0.4 mm)

MAX

I MAX

(BR)DSS

DS(on)

• Low R

Solution in 0.62 x 0.62 mm Package

DS(on)

1.6 W @ −4.5 V

2.4 W @ −2.5 V

3.3 W @ −1.8 V

4.5 W @ −1.5 V

• 1.5 V Gate Voltage Rating

−20 V

−214 mA

• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

Compliant

Applications

• Small Signal Load Switch

• Analog Switch

P−Channel MOSFET

D (3)

• High Speed Interfacing

• Optimized for Power Management in Ultra Portable Products

MAXIMUM RATINGS (T = 25°C unless otherwise stated)

G (1)

Parameter

Drain-to-Source Voltage

Gate-to-Source Voltage

Symbol

Value

−20

Units

DSS

S (2)

8.0

MARKING

DIAGRAM

Continuous Drain

Current (Note 1)

Steady

T = 25°C

−214

−155

−277

125

State

T = 85°C

t ≤ 5 s

T = 25°C

XLLGA3

CASE 713AA

X M

Power Dissipa-

tion (Note 1)

Steady

State

T = 25°C

= Specific Device Code

t ≤ 5 s

T = 25°C

208

M = Date Code

Pulsed Drain Current

t = 10 ms

−643

Operating Junction and Storage

Temperature

T ,

STG

-55 to

150

°C

ORDERING INFORMATION

Source Current (Body Diode) (Note 2)

−208

†

Device

NTNS3A91PZT5G

Package

Shipping

8000 /

Tape & Reel

Lead Temperature for Soldering Purposes

(1/8″ from case for 10 s)

260

°C

XLLGA3

(Pb−Free)

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

THERMAL RESISTANCE RATINGS

Parameter

Symbol

Max

1000

600

Units

Junction-to-Ambient – Steady State (Note 1)

Junction-to-Ambient – t ≤ 5 s (Note 1)

°C/W

θJA

1. Surface Mounted on FR4 Board using the minimum recommended pad size,

(or 2 mm ), 1 oz Cu.

2. Pulse Test: pulse width ≤ 300 ms, duty cycle ≤ 2%.

This document contains information on a new product. Specifications and information

herein are subject to change without notice.

Publication Order Number:

June, 2012 − Rev. P2

NTNS3A91PZ/D

12 3

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