NTNS3C68NZ
Small Signal MOSFET
12 V, 758 mA, Single N−Channel SOT−883
(XDFN3) 1.0 x 0.6 x 0.4 mm Package
Features
• Single N−Channel MOSFET
www.onsemi.com
MOSFET
• Ultra Low Profile SOT−883 (XDFN3) 1.0 x 0.6 x 0.4 mm for
Extremely Thin Environments such as Portable Electronics
• Low R
Solution in Ultra Small 1.0 x 0.6 mm Package
DS(on)
V
R
MAX
I MAX
D
(BR)DSS
DS(on)
• 1.8 V Gate Drive
0.160 W @ 4.5 V
0.175 W @ 3.7 V
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
12 V
0.185 W @ 3.3 V
0.230 W @ 2.5 V
0.440 W @ 1.8 V
758 mA
Applications
• Load Switch
• High Speed Interfacing
• Level Shift and Translate
• Optimized for Power Management in Ultra Portable Solutions
N−Channel MOSFET
D (3)
MAXIMUM RATINGS (T = 25°C unless otherwise stated)
J
Parameter
Drain-to-Source Voltage
Gate-to-Source Voltage
Symbol
Value
12
Units
V
G (1)
V
DSS
V
GS
8
V
Continuous Drain
Current (Note 1)
Steady
State
T = 25°C
I
758
547
898
156
mA
A
D
T = 85°C
A
t ≤ 5 s
T = 25°C
A
S (2)
Power Dissipa-
tion (Note 1)
Steady
State
T = 25°C
A
P
mW
D
MARKING
DIAGRAM
t ≤ 5 s
T = 25°C
219
2.2
A
3
SOT−883
(XDFN3)
CASE 506CB
Pulsed Drain Current
t = 10 ms
p
I
A
DM
AC M
Operating Junction and Storage
Temperature
T ,
-55 to
150
°C
1
J
2
T
STG
AC = Specific Device Code
= Date Code
Source Current (Body Diode) (Note 2)
I
223
260
mA
S
M
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T
°C
L
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
ORDERING INFORMATION
†
Device
NTNS3C68NZT5G
Package
Shipping
THERMAL RESISTANCE RATINGS
SOT−883
(Pb−Free)
8000 /
Tape & Reel
Parameter
Symbol
Max
800
570
Units
Junction-to-Ambient – Steady State (Note 1)
Junction-to-Ambient – t ≤ 5 s (Note 1)
R
°C/W
θJA
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
R
θJA
1. Surface Mounted on FR4 Board using the minimum recommended pad size,
2
(or 2 mm ), 1 oz Cu.
2. Pulse Test: pulse width ≤ 300 ms, duty cycle ≤ 2%.
© Semiconductor Components Industries, LLC, 2016
1
Publication Order Number:
June, 2016 − Rev. 0
NTNS3C68NZ/D