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NTNS3C68NZ PDF预览

NTNS3C68NZ

更新时间: 2024-10-03 01:10:43
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
6页 71K
描述
Small Signal MOSFET

NTNS3C68NZ 数据手册

 浏览型号NTNS3C68NZ的Datasheet PDF文件第2页浏览型号NTNS3C68NZ的Datasheet PDF文件第3页浏览型号NTNS3C68NZ的Datasheet PDF文件第4页浏览型号NTNS3C68NZ的Datasheet PDF文件第5页浏览型号NTNS3C68NZ的Datasheet PDF文件第6页 
NTNS3C68NZ  
Small Signal MOSFET  
12 V, 758 mA, Single N−Channel SOT−883  
(XDFN3) 1.0 x 0.6 x 0.4 mm Package  
Features  
Single N−Channel MOSFET  
www.onsemi.com  
MOSFET  
Ultra Low Profile SOT−883 (XDFN3) 1.0 x 0.6 x 0.4 mm for  
Extremely Thin Environments such as Portable Electronics  
Low R  
Solution in Ultra Small 1.0 x 0.6 mm Package  
DS(on)  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(on)  
1.8 V Gate Drive  
0.160 W @ 4.5 V  
0.175 W @ 3.7 V  
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS  
Compliant  
12 V  
0.185 W @ 3.3 V  
0.230 W @ 2.5 V  
0.440 W @ 1.8 V  
758 mA  
Applications  
Load Switch  
High Speed Interfacing  
Level Shift and Translate  
Optimized for Power Management in Ultra Portable Solutions  
N−Channel MOSFET  
D (3)  
MAXIMUM RATINGS (T = 25°C unless otherwise stated)  
J
Parameter  
Drain-to-Source Voltage  
Gate-to-Source Voltage  
Symbol  
Value  
12  
Units  
V
G (1)  
V
DSS  
V
GS  
8
V
Continuous Drain  
Current (Note 1)  
Steady  
State  
T = 25°C  
I
758  
547  
898  
156  
mA  
A
D
T = 85°C  
A
t 5 s  
T = 25°C  
A
S (2)  
Power Dissipa-  
tion (Note 1)  
Steady  
State  
T = 25°C  
A
P
mW  
D
MARKING  
DIAGRAM  
t 5 s  
T = 25°C  
219  
2.2  
A
3
SOT−883  
(XDFN3)  
CASE 506CB  
Pulsed Drain Current  
t = 10 ms  
p
I
A
DM  
AC M  
Operating Junction and Storage  
Temperature  
T ,  
-55 to  
150  
°C  
1
J
2
T
STG  
AC = Specific Device Code  
= Date Code  
Source Current (Body Diode) (Note 2)  
I
223  
260  
mA  
S
M
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
°C  
L
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
ORDERING INFORMATION  
Device  
NTNS3C68NZT5G  
Package  
Shipping  
THERMAL RESISTANCE RATINGS  
SOT−883  
(Pb−Free)  
8000 /  
Tape & Reel  
Parameter  
Symbol  
Max  
800  
570  
Units  
Junction-to-Ambient – Steady State (Note 1)  
Junction-to-Ambient – t 5 s (Note 1)  
R
°C/W  
θJA  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
R
θJA  
1. Surface Mounted on FR4 Board using the minimum recommended pad size,  
2
(or 2 mm ), 1 oz Cu.  
2. Pulse Test: pulse width 300 ms, duty cycle 2%.  
© Semiconductor Components Industries, LLC, 2016  
1
Publication Order Number:  
June, 2016 − Rev. 0  
NTNS3C68NZ/D  
 

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