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NTNS3C94NZT5G PDF预览

NTNS3C94NZT5G

更新时间: 2024-10-03 01:10:43
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
6页 71K
描述
Small Signal MOSFET

NTNS3C94NZT5G 数据手册

 浏览型号NTNS3C94NZT5G的Datasheet PDF文件第2页浏览型号NTNS3C94NZT5G的Datasheet PDF文件第3页浏览型号NTNS3C94NZT5G的Datasheet PDF文件第4页浏览型号NTNS3C94NZT5G的Datasheet PDF文件第5页浏览型号NTNS3C94NZT5G的Datasheet PDF文件第6页 
NTNS3C94NZ  
Small Signal MOSFET  
12 V, 384 mA, Single N−Channel,  
0.62 x 0.62 x 0.4 mm XLLGA3 Package  
Features  
Single N−Channel MOSFET  
www.onsemi.com  
MOSFET  
Ultra Small and Thin Package (0.62 x 0.62 x 0.4 mm)  
Low R  
Solution in 0.62 x 0.62 mm Package  
DS(on)  
1.8 V Gate Voltage Rating  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(on)  
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS  
0.48 W @ 4.5 V  
0.54 W @ 3.7 V  
0.60 W @ 3.3 V  
0.80 W @ 2.5 V  
1.90 W @ 1.8 V  
Compliant  
Applications  
12 V  
384 mA  
Small Signal Load Switch  
Analog Switch  
High Speed Interfacing  
Optimized for Power Management in Ultra Portable Products  
N−Channel MOSFET  
D (3)  
MAXIMUM RATINGS (T = 25°C unless otherwise stated)  
J
Parameter  
Drain-to-Source Voltage  
Gate-to-Source Voltage  
Symbol  
Value  
12  
Units  
V
V
DSS  
V
GS  
8
V
G (1)  
Continuous Drain  
Current (Note 1)  
Steady  
State  
T = 25°C  
I
384  
277  
413  
120  
mA  
A
D
T = 85°C  
A
S (2)  
t 5 s  
T = 25°C  
A
Power Dissipa-  
tion (Note 1)  
Steady  
State  
T = 25°C  
A
P
mW  
D
MARKING  
DIAGRAM  
t 5 s  
T = 25°C  
140  
115  
A
1
3
XLLGA3  
CASE 713AE  
Pulsed Drain Current  
t = 10 ms  
p
I
A
E M  
DM  
2
Operating Junction and Storage  
Temperature  
T ,  
-55 to  
150  
°C  
J
1
T
STG  
E
= Specific Device Code  
Source Current (Body Diode) (Note 2)  
I
157  
260  
mA  
S
M = Date Code  
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
°C  
L
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
ORDERING INFORMATION  
Device  
Package  
Shipping  
8000 /  
Tape & Reel  
THERMAL RESISTANCE RATINGS  
NTNS3C94NZT5G  
XLLGA3  
(Pb−Free)  
Parameter  
Symbol  
Max  
1040  
900  
Units  
Junction-to-Ambient – Steady State (Note 1)  
Junction-to-Ambient – t 5 s (Note 1)  
R
°C/W  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
θJA  
R
θJA  
1. Surface Mounted on FR4 Board using the minimum recommended pad size,  
2
(or 2 mm ), 1 oz Cu.  
2. Pulse Test: pulse width 300 ms, duty cycle 2%.  
© Semiconductor Components Industries, LLC, 2016  
1
Publication Order Number:  
December, 2016 − Rev. 1  
NTNS3C94NZ/D  
 

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