NSWC Series
Stacked Film Capacitor Chips
FEATURES
• STACKED METALLIZED POLYETHYLENE NAPHTHALATE (PEN) FILM
• STANDARD EIA 1206, 1210, 1913, 2416, 2820, 3022 AND 3925 SIZES
• WIDE TEMPERATURE RANGE UP TO +105OC (16Vdc & 50Vdc)
• HIGH HEAT AND MOISTURE RESISTANT
RoHS
Compliant
• VERY STABLE TEMPERATURE, FREQUENCY, VOLTAGE, BIAS AND
nDIELECTRIC ABSORPTION CHARACTERISTICS
includes all homogeneous materials
*See Part Number System for Details
• SUITABLE FOR REFLOWSOLDERING
• TAPE AND REEL PACKAGING
RECOMMENDED
NSWC IS
FOR NEW DESIGNS
Case Sizes
2416
SPECIFICATIONS
1206
1210
1913
2820
3022
3925
Capacitance Range
Votage Ratings
0.001 ~ 0.0047µF 0.00561 ~ 0.01µF 0.012 ~ 0.22µF 0.1 ~ 0.47µF 0.18 ~ 0.33µF 0.39 ~ 0.47µF 0.56 ~ 1.0µF
16Vdc, 50Vdc, 100Vdc
16V and 50V ±5% (J) or ±10% (K)
100V 0.001 ~ 0.01µF 5% (J) only , 0.012 ~ 0.15µF 5% (J) or 10% (K), 0.18 ~ 1.0µF 10% (K) only
Capacitance Tolerance
Temperature Range
-55°C ~ +105°C (16Vdc and 50Vdc), -55°C ~ +85°C (100Vdc)
Dissipation factor (20°C)
1.0% max. @ 1KHz
3 Gigohms or 1000Ω/F whichever is lower
Insulation resistance (20°C)
(16Vdc parts measured at 10Vdc)
Dielectric Withstanding
Voltage
150% of Rated Voltage 60 Seconds
175% of Rated Voltage for 5 Seconds (except 100Vdc parts)
Temperature Characteristic
Dielectric Absorption
±3% ∆C Maximum Over Temperature Range
0.05 ~ 0.10% Typical
ENVIRONMENTAL CHARACTERISTICS
Capacitance Change
Within +1%/-6% of Initial Value
1.1% Maximum
1 Gigohm Minimum or 300Ω/F whichever is lower
Within ±3% of Initial Value
1.1% Maximum
1 Gigohm Minimum or 300Ω/F whichever is lower
Life Test At +105°C
1,000 Hours at 125% of Rated Voltage
(85°C for 100Vdc)
Dissipation Factor
Insulation Resistance
Capacitance Change
Dissipation Factor
Insulation Resistance
Capacitance Change
Dissipation Factor
Resistance to Soldering Heat:
+240°C Peak for 5 Seconds
(+230°C for 100Vdc)
(1) +8%/-5%
(2) ±10% of Initial Value
Humidity Load Life (90% ~ 95% RH)
(1) 1,000 Hours, +40°C
(1) 1.5% Max.
(2) 2.0% Max.
(1) 100 Megohm Min. or 30Ω/F
(2) 10 Megohm Min. or 3Ω/F
whichever is lower
(500 Hours for 100Vdc)
(2) 500 Hours, +60°C
Insulation Resistance
Solderability with
10% Wt Rosin-Methanol Flux
90% Minimum Coverage After 5 Second Dip Into 235°C Solder Pot
RECOMMENDED REFLOW PROFILE
RECOMMENDED LAND PATTERN (mm)
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300
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Peak Temperature
(235°C for 5 sec.)
250
200
150
Cool Down
100
50
Time above 220°C
30 sec. max
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Pre-heat
150°C ~ 180°C 120 sec. max.
25
0
Time
A
B
®
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com
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