Datasheet > NSWC393J400TRG4F

NSWC393J400TRG4F

更新时间： 2023-01-02 15:11:17

品牌	Logo	应用领域
尼吉康 - NICHICON		/
页数	文件大小	规格书
4页	353K
描述
CAPACITOR, METALLIZED FILM, POLYETHYLENE NAPHTHALATE, 400V, 0.039uF, SURFACE MOUNT, 2820, CHIP, ROHS COMPLIANT

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NSWC393J400TRG4F 数据手册

NSWC Series

Stacked Film Capacitor Chips

FEATURES

• STACKED METALLIZED POLYETHYLENE NAPHTHALATE (PEN) FILM

• STANDARD EIA 1206, 1210, 1913, 2416, 2820, 3022 AND 3925 SIZES

• WIDE TEMPERATURE RANGE UP TO +105^OC (16Vdc & 50Vdc)

• HIGH HEAT AND MOISTURE RESISTANT

RoHS

Compliant

• VERY STABLE TEMPERATURE, FREQUENCY, VOLTAGE, BIAS AND

nDIELECTRIC ABSORPTION CHARACTERISTICS

includes all homogeneous materials

*See Part Number System for Details

• SUITABLE FOR REFLOWSOLDERING

• TAPE AND REEL PACKAGING

RECOMMENDED

NSWC IS

FOR NEW DESIGNS

Case Sizes

2416

SPECIFICATIONS

1206

1210

1913

2820

3022

3925

Capacitance Range

Votage Ratings

0.001 ~ 0.0047µF 0.00561 ~ 0.01µF 0.012 ~ 0.22µF 0.1 ~ 0.47µF 0.18 ~ 0.33µF 0.39 ~ 0.47µF 0.56 ~ 1.0µF

16Vdc, 50Vdc, 100Vdc

16V and 50V ±5% (J) or ±10% (K)

100V 0.001 ~ 0.01µF 5% (J) only , 0.012 ~ 0.15µF 5% (J) or 10% (K), 0.18 ~ 1.0µF 10% (K) only

Capacitance Tolerance

Temperature Range

-55°C ~ +105°C (16Vdc and 50Vdc), -55°C ~ +85°C (100Vdc)

Dissipation factor (20°C)

1.0% max. @ 1KHz

3 Gigohms or 1000Ω/F whichever is lower

Insulation resistance (20°C)

(16Vdc parts measured at 10Vdc)

Dielectric Withstanding

Voltage

150% of Rated Voltage 60 Seconds

175% of Rated Voltage for 5 Seconds (except 100Vdc parts)

Temperature Characteristic

Dielectric Absorption

±3% ∆C Maximum Over Temperature Range

0.05 ~ 0.10% Typical

ENVIRONMENTAL CHARACTERISTICS

Capacitance Change

Within +1%/-6% of Initial Value

1.1% Maximum

1 Gigohm Minimum or 300Ω/F whichever is lower

Within ±3% of Initial Value

1.1% Maximum

1 Gigohm Minimum or 300Ω/F whichever is lower

Life Test At +105°C

1,000 Hours at 125% of Rated Voltage

(85°C for 100Vdc)

Dissipation Factor

Insulation Resistance

Capacitance Change

Dissipation Factor

Insulation Resistance

Capacitance Change

Dissipation Factor

Resistance to Soldering Heat:

+240°C Peak for 5 Seconds

(+230°C for 100Vdc)

(1) +8%/-5%

(2) ±10% of Initial Value

Humidity Load Life (90% ~ 95% RH)

(1) 1,000 Hours, +40°C

(1) 1.5% Max.

(2) 2.0% Max.

(1) 100 Megohm Min. or 30Ω/F

(2) 10 Megohm Min. or 3Ω/F

whichever is lower

(500 Hours for 100Vdc)

(2) 500 Hours, +60°C

Insulation Resistance

Solderability with

10% Wt Rosin-Methanol Flux

90% Minimum Coverage After 5 Second Dip Into 235°C Solder Pot

RECOMMENDED REFLOW PROFILE

RECOMMENDED LAND PATTERN (mm)

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300

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Peak Temperature

(235°C for 5 sec.)

250

200

150

Cool Down

100

Time above 220°C

30 sec. max

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Pre-heat

150°C ~ 180°C 120 sec. max.

Time

NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com

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