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NSV1C200LT1G PDF预览

NSV1C200LT1G

更新时间： 2024-09-29 11:01:35
品牌 Logo 应用领域
安森美 - ONSEMI 小信号双极晶体管
页数 文件大小 规格书
5页 73K
描述
低饱和压晶体管，PNP，100 V，2.0 A

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NSV1C200LT1G 数据手册

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NSS1C200LT1G  
100 V, 3.0 A, Low VCE(sat)  
PNP Transistor  
2
ON Semiconductor's e PowerEdge family of low V  
CE(sat)  
transistors are miniature surface mount devices featuring ultra low  
saturation voltage (V ) and high current gain capability. These  
CE(sat)  
http://onsemi.com  
are designed for use in low voltage, high speed switching applications  
where affordable efficient energy control is important.  
Typical applications are DC-DC converters and power management  
in portable and battery powered products such as cellular and cordless  
phones, PDAs, computers, printers, digital cameras and MP3 players.  
Other applications are low voltage motor controls in mass storage  
products such as disc drives and tape drives. In the automotive  
industry they can be used in air bag deployment and in the instrument  
-100 VOLTS, 3.0 AMPS  
PNP LOW VCE(sat) TRANSISTOR  
COLLECTOR  
3
2
cluster. The high current gain allows e PowerEdge devices to be  
driven directly from PMU's control outputs, and the Linear Gain  
(Beta) makes them ideal components in analog amplifiers.  
•ꢀThis is a Pb-Free Device  
1
BASE  
2
EMITTER  
MAXIMUM RATINGS (T = 25°C)  
A
Rating  
Symbol  
Max  
-100  
-140  
-7.0  
-2.0  
-3.0  
Unit  
Vdc  
Vdc  
Vdc  
A
Collector‐Emitter Voltage  
Collector‐Base Voltage  
Emitter‐Base Voltage  
V
CEO  
3
V
CBO  
1
V
EBO  
2
Collector Current - Continuous  
Collector Current - Peak  
I
C
SOT-23 (TO-236)  
CASE 318  
STYLE 6  
I
A
CM  
THERMAL CHARACTERISTICS  
Characteristic  
Symbol  
Max  
Unit  
DEVICE MARKING  
Total Device Dissipation  
T = 25°C  
Derate above 25°C  
P
(Note 1)  
490  
mW  
D
A
3.7  
mW/°C  
°C/W  
VL MG  
G
Thermal Resistance,  
Junction-to-Ambient  
R
q
(Note 1)  
255  
JA  
1
Total Device Dissipation  
T = 25°C  
Derate above 25°C  
P
(Note 2)  
(Note 2)  
710  
mW  
D
VL = Specific Device Code  
= Date Code*  
A
M
4.3  
mW/°C  
°C/W  
G
= Pb-Free Package  
Thermal Resistance,  
Junction-to-Ambient  
R
q
176  
JA  
(Note: Microdot may be in either location)  
*Date Code orientation and/or overbar may  
vary depending upon manufacturing location.  
Junction and Storage  
Temperature Range  
T , T  
J
-55 to  
+150  
°C  
stg  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
ORDERING INFORMATION  
†
Device  
Package  
Shipping  
2
1. FR-ā4 @ 100 mm , 1 oz. copper traces.  
2
NSS1C200LT1G  
SOT-23  
(Pb-Free)  
3000/Tape & Reel  
2. FR-ā4 @ 500 mm , 1 oz. copper traces.  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
©ꢀ Semiconductor Components Industries, LLC, 2008  
March, 2008 - Rev. 0  
1
Publication Order Number:  
NSS1C200L/D  
 
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