NSS12100UW3TCG
12 V, 1 A, Low VCE(sat)
PNP Transistor
2
ON Semiconductor's e PowerEdge family of low V
CE(sat)
transistors are miniature surface mount devices featuring ultra low
saturation voltage (V ) and high current gain capability. These
are designed for use in low voltage, high speed switching applications
where affordable efficient energy control is important.
CE(sat)
http://onsemi.com
12 VOLTS, 1.0 AMPS
Typical application are DC-DC converters and power management
in portable and battery powered products such as cellular and cordless
phones, PDAs, computers, printers, digital cameras and MP3 players.
Other applications are low voltage motor controls in mass storage
products such as disc drives and tape drives. In the automotive
industry they can be used in air bag deployment and in the instrument
cluster. The high current gain allows e PowerEdge devices to be
driven directly from PMU's control outputs, and the Linear Gain
(Beta) makes them ideal components in analog amplifiers.
PNP LOW VCE(sat) TRANSISTOR
EQUIVALENT RDS(on) 400 mW
COLLECTOR
3
2
1
BASE
Features
•ꢀHigh Current Capability (1 A)
•ꢀHigh Power Handling (Up to 740 mW)
2
EMITTER
•ꢀLow V
(200 mV Typical @ 500 mA)
CE(s)
•ꢀSmall Size
•ꢀLow Noise
•ꢀThis is a Pb-Free Device
3
WDFN3
CASE 506AU
2
1
Benefits
•ꢀHigh Specific Current and Power Capability Reduces Required PCB Area
•ꢀReduced Parasitic Losses Increases Battery Life
MARKING DIAGRAM
VG M
G
MAXIMUM RATINGS (T = 25°C)
A
1
Rating
Symbol
Max
-12
-12
-5.0
Unit
Vdc
Vdc
Vdc
Adc
VG = Specific Device Code
M
= Date Code
= Pb-Free Package
Collector‐Emitter Voltage
Collector‐Base Voltage
Emitter‐Base Voltage
V
CEO
V
CBO
V
EBO
G
ORDERING INFORMATION
Collector Current - Continuous
Collector Current - Peak
I
C
-1.0
-2.0
I
CM
†
Device
NSS12100UW3TCG
Package
Shipping
Electrostatic Discharge
ESD
HBM Class 3B
MM Class C
WDFN3
(Pb-Free)
3000/
Tape & Reel
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
©ꢀ Semiconductor Components Industries, LLC, 2008
April, 2008 - Rev. 0
1
Publication Order Number:
NSS12100UW3/D