Pb Free Product
http://www.ncepower.com
NCE6075
Thermal Characteristic
Thermal Resistance,Junction-to-Case(Note 2)
RθJC
1.25
℃/W
Electrical Characteristics (TA=25℃unless otherwise noted)
Parameter
Symbol
Condition
Min Typ
Max
Unit
Off Characteristics
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Body Leakage Current
On Characteristics (Note 3)
Gate Threshold Voltage
Drain-Source On-State Resistance
Forward Transconductance
Dynamic Characteristics (Note4)
Input Capacitance
BVDSS
IDSS
VGS=0V ID=250μA
VDS=60V,VGS=0V
VGS=±20V,VDS=0V
60
V
1
μA
nA
IGSS
±100
VGS(th)
RDS(ON)
gFS
VDS=VGS,ID=250μA
VGS=10V, ID=30A
VDS=25V,ID=30A
2
4
V
mΩ
S
8.4
15
20
Clss
Coss
Crss
1300
350
85
PF
PF
PF
VDS=25V,VGS=0V,
Output Capacitance
F=1.0MHz
Reverse Transfer Capacitance
Switching Characteristics (Note 4)
Turn-on Delay Time
td(on)
tr
td(off)
tf
12
60
40
45
42
9
nS
nS
nS
nS
nC
nC
nC
Turn-on Rise Time
VDD=28V,ID=30A
VGS=10V,RGEN=4.5Ω
Turn-Off Delay Time
Turn-Off Fall Time
Total Gate Charge
Qg
Qgs
Qgd
VDS=44V,ID=30A,
Gate-Source Charge
VGS=10V
Gate-Drain Charge
15
Drain-Source Diode Characteristics
Diode Forward Voltage (Note 3)
Diode Forward Current (Note 2)
Reverse Recovery Time
VSD
IS
VGS=0V,IS=30A
1.2
75
V
A
trr
TJ = 25°C, IF =30A
62
100
200
nS
nC
Reverse Recovery Charge
di/dt = 100A/μs(Note3)
Qrr
ton
150
Forward Turn-On Time
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Notes:
1. Repetitive Rating: Pulse width limited by maximum junction temperature.
2. Surface Mounted on FR4 Board, t ≤ 10 sec.
3. Pulse Test: Pulse Width ≤ 300μs, Duty Cycle ≤ 2%.
4. Guaranteed by design, not subject to production
5. EAS condition:Tj=25℃,VDD=30V,VG=10V,L=0.5mH,Rg=25Ω
Wuxi NCE Power Semiconductor Co., Ltd
Page 2
v1.0