是否无铅: | 不含铅 | 生命周期: | Lifetime Buy |
零件包装代码: | SSOP | 包装说明: | 4.40 X 9.70 MM, LEAD FREE, TSSOP-28 |
针数: | 28 | Reach Compliance Code: | compliant |
HTS代码: | 8542.39.00.01 | 风险等级: | 8.32 |
JESD-30 代码: | R-PDSO-G28 | JESD-609代码: | e3 |
长度: | 9.7 mm | 湿度敏感等级: | 3 |
功能数量: | 1 | 端子数量: | 28 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | TSSOP |
封装等效代码: | TSSOP28,.25 | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 峰值回流温度(摄氏度): | NOT SPECIFIED |
电源: | 3.3 V | 认证状态: | Not Qualified |
座面最大高度: | 1.2 mm | 子类别: | Other Telecom ICs |
最大压摆率: | 0.125 mA | 标称供电电压: | 3.3 V |
表面贴装: | YES | 电信集成电路类型: | SUPPORT CIRCUIT |
温度等级: | INDUSTRIAL | 端子面层: | Tin (Sn) |
端子形式: | GULL WING | 端子节距: | 0.65 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 4.4 mm | Base Number Matches: | 1 |
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