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N08M1618L1AD-150I PDF预览

N08M1618L1AD-150I

更新时间: 2024-11-29 19:44:07
品牌 Logo 应用领域
AMI 静态存储器内存集成电路
页数 文件大小 规格书
11页 194K
描述
Standard SRAM, 512KX16, 150ns, CMOS, DIE

N08M1618L1AD-150I 技术参数

生命周期:Transferred包装说明:DIE
Reach Compliance Code:unknown风险等级:5.79
最长访问时间:150 nsJESD-30 代码:X-XUUC-N
内存密度:8388608 bit内存集成电路类型:STANDARD SRAM
内存宽度:16功能数量:1
字数:524288 words字数代码:512000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:512KX16
封装主体材料:UNSPECIFIED封装代码:DIE
封装形状:UNSPECIFIED封装形式:UNCASED CHIP
并行/串行:PARALLEL认证状态:Not Qualified
最大供电电压 (Vsup):2.2 V最小供电电压 (Vsup):1.4 V
标称供电电压 (Vsup):1.8 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:NO LEAD端子位置:UPPER
Base Number Matches:1

N08M1618L1AD-150I 数据手册

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AMI Semiconductor, Inc.  
ULP Memory Solutions  
N08M1618L1A  
670 North McCarthy Blvd. Suite 220  
Milpitas, CA 95035  
Advance Information  
PH: 408-935-7777, FAX: 408-935-7770  
8Mb Ultra-Low Power Asynchronous Medical CMOS SRAM  
512K × 16 bit  
Overview  
Features  
The N08M1618L1A is an integrated memory  
device intended for non life-support medical  
applications. This device is a 8 megabit memory  
organized as 524,288 words by 16 bits. The device  
is designed and fabricated using AMI  
• Dual voltage for Optimum Performance:  
Vccq - 2.3 to 3.6 Volts  
Vcc - 1.4 to 2.2 Volts  
• Very low standby current  
0.5µA at 1.8V and 37 deg C  
Semiconductor’s advanced CMOS technology with  
reliability inhancements for medical users. The  
device operates with two chip enable (CE1 and  
CE2) controls and output enable (OE) to allow for  
easy memory expansion. Byte controls (UB and  
LB) allow the upper and lower bytes to be  
• Very low operating current  
1.0mA at 1.8V and 1µs (Typical)  
• Very low Page Mode operating current  
0.5mA at 1.8V and 1µs (Typical)  
• Simple memory control  
accessed independently and can also be used to  
deselect the device. This device is optimal for  
various applications where low-power is critical  
such as battery backup and hand-held devices.  
The device can operate over a very wide  
Dual Chip Enables (CE1 and CE2)  
Byte control for independent byte operation  
Output Enable (OE) for memory expansion  
• Low voltage data retention  
Vcc = 1.2V  
o
o
temperature range of -40 C to +85 C and is  
• Special Processing to reduce Soft Error Rate  
available in a JEDEC standard BGA package.  
(SER)  
• Automatic power down to standby mode  
Product Family  
Standby  
Operating  
Current (Icc),  
Max  
Operating  
Power  
Current (ISB),  
Part Number  
N08M1618L1AB  
N08M1618L1AW  
Package Type  
48 - BGA  
Wafer  
Speed  
Temperature  
Supply  
Max  
2.3V-3.6V(VCCQ  
1.4V-2.2V(VCC) 150ns @ 1.4V  
)
85ns @ 1.7V  
2.5 mA @  
1MHz  
-40oC to +85oC  
20 µA  
Pin Configuration  
Pin Descriptions  
1
2
3
A0  
A3  
4
5
A2  
6
Pin Name  
A0-A18  
WE  
CE1, CE2  
OE  
LB  
UB  
I/O0-I/O15  
Pin Function  
A1  
A4  
A6  
A7  
LB  
OE  
CE2  
A
B
C
D
E
F
Address Inputs  
Write Enable Input  
Chip Enable Input  
I/O8  
I/O0  
UB  
CE1  
I/O9 I/O10 A5  
VSS I/O11 A17  
I/O1 I/O2  
I/O3 VCC  
Output Enable Input  
Lower Byte Enable Input  
Upper Byte Enable Input  
Data Inputs/Outputs  
VCCQ I/O12  
I/O14 I/O13 A14  
A16 I/O4 VSS  
A15 I/O5 I/O6  
NC  
I/O15  
A18  
A12  
A9  
A13  
A10  
I/O7  
NC  
NC  
A8  
WE  
A11  
G
H
VCC  
VSS  
Power  
Ground  
48 Pin BGA (top)  
8 x 10 mm  
VCCQ  
NC  
Power I/O pins only  
Not Connected  
Stock No. 23211-03 9/21/06  
ADVANCE INFORMATION  
1
The specifications of this device are subject to change without notice. For latest documentation see http://www.amis.com.  

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