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N08M163WL1AB-70I-TR PDF预览

N08M163WL1AB-70I-TR

更新时间: 2024-11-29 13:11:55
品牌 Logo 应用领域
NANOAMP 医疗静态存储器
页数 文件大小 规格书
8页 235K
描述
Standard SRAM, 512KX16, 70ns, CMOS, PBGA48

N08M163WL1AB-70I-TR 技术参数

是否Rohs认证:不符合生命周期:Contact Manufacturer
包装说明:FBGA, BGA48,6X8,30Reach Compliance Code:unknown
风险等级:5.88Is Samacsys:N
最长访问时间:70 nsI/O 类型:COMMON
JESD-30 代码:R-PBGA-B48内存密度:8388608 bit
内存集成电路类型:STANDARD SRAM内存宽度:16
端子数量:48字数:524288 words
字数代码:512000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:512KX16输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:FBGA
封装等效代码:BGA48,6X8,30封装形状:RECTANGULAR
封装形式:GRID ARRAY, FINE PITCH并行/串行:PARALLEL
电源:3/3.3 V认证状态:Not Qualified
最小待机电流:1.8 V子类别:SRAMs
最大压摆率:0.012 mA表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:BALL端子节距:0.75 mm
端子位置:BOTTOMBase Number Matches:1

N08M163WL1AB-70I-TR 数据手册

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NanoAmp Solutions, Inc.  
670 North McCarthy Blvd. Suite 220, Milpitas, CA 95035  
ph: 408-935-7777, FAX: 408-935-7770  
www.nanoamp.com  
N08M163WL1A  
8Mb Ultra-Low Power Asynchronous Medical CMOS SRAM  
512Kx16 bit  
Overview  
Features  
The N08M163WL1A is an integrated memory  
device intended for non life-support (Class 1 or  
2) medical applications. This device is a 4  
megabit memory organized as 524,288 words by  
16 bits. The device is designed and fabricated  
using NanoAmp’s advanced CMOS technology  
with reliability inhancements for medical users. The  
base design is the same as NanoAmp’s  
• Single Wide Power Supply Range  
2.3 to 3.6 Volts  
• Very low standby current  
4.0µA at 3.0V (Typical)  
• Very low operating current  
2.0mA at 3.0V and 1µs (Typical)  
• Very low Page Mode operating current  
N08M1618L2A, which has further reliability  
processing for life-support (Class 3) medical  
applications. The device operates with two chip  
enable (CE1 and CE2) controls and output enable  
(OE) to allow for easy memory expansion. Byte  
controls (UB and LB) allow the upper and lower  
bytes to be accessed independently and can also  
be used to deselect the device. This device is  
optimal for various applications where low-power is  
critical such as battery backup and hand-held  
devices. The device can operate over a very wide  
1.0mA at 3.0V and 1µs (Typical)  
• Simple memory control  
Dual Chip Enables (CE1 and CE2)  
Byte control for independent byte operation  
Output Enable (OE) for memory expansion  
• Low voltage data retention  
Vcc = 1.8V  
• Special processing for Soft Error Rate (SER)  
reduction  
• Automatic power down to standby mode  
o
o
temperature range of -40 C to +85 C and is  
• Compact space saving BGA package avail-  
available in a JEDEC standard BGA package  
able  
Product Family  
Standby  
Operating  
Current (Icc),  
Max  
Operating  
Power  
Current (ISB),  
Part Number  
Package Type  
Speed  
Temperature  
Supply (Vcc)  
Max  
N08M163WL1AB  
48 - BGA  
70ns @ 2.7V  
100ns @ 2.3V  
-40oC to +85oC  
2.3V - 3.6V  
20 µA  
3 mA @ 1MHz  
N08M163WL1AD Known Good Die  
Pin Configurations  
Pin Descriptions  
1
2
3
A0  
A3  
4
5
A2  
6
Pin Name  
A0-A18  
WE  
CE1, CE2  
OE  
LB  
UB  
I/O0-I/O15  
Pin Function  
A1  
A4  
A6  
A7  
LB  
OE  
CE2  
A
B
C
D
E
F
Address Inputs  
Write Enable Input  
Chip Enable Input  
I/O8  
I/O0  
UB  
CE1  
I/O9 I/O10 A5  
VSS I/O11 A17  
I/O1 I/O2  
I/O3 VCC  
Output Enable Input  
Lower Byte Enable Input  
Upper Byte Enable Input  
Data Inputs/Outputs  
VCC I/O12  
I/O14 I/O13 A14  
A16 I/O4 VSS  
A15 I/O5 I/O6  
NC  
I/O15  
A18  
A12  
A9  
A13  
A10  
I/O7  
NC  
NC  
A8  
WE  
A11  
G
H
VCC  
VSS  
NC  
Power  
Ground  
Not Connected  
48 Pin BGA (top)  
8 x 10 mm  
Stock No. 23319-01 11/01/02  
The specifications of this device are subject to change without notice. For latest documentation see http://www.nanoamp.com.  
1

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