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MXUPS5817E3TR13 PDF预览

MXUPS5817E3TR13

更新时间: 2024-02-23 17:39:53
品牌 Logo 应用领域
美高森美 - MICROSEMI 瞄准线二极管
页数 文件大小 规格书
4页 296K
描述
Rectifier Diode, Schottky, 1 Element, 1A, Silicon, DO-216AA, ROHS COMPLIANT, PLASTIC, POWERMITE 1, DO-216, 1 PIN

MXUPS5817E3TR13 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:DO-216包装说明:S-PSSO-G1
针数:1Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8541.10.00.80
风险等级:5.7其他特性:FREE WHEELING DIODE, LOW POWER LOSS
外壳连接:CATHODE配置:SINGLE
二极管元件材料:SILICON二极管类型:RECTIFIER DIODE
JEDEC-95代码:DO-216AAJESD-30 代码:S-PSSO-G1
JESD-609代码:e3元件数量:1
端子数量:1最高工作温度:150 °C
最低工作温度:-55 °C最大输出电流:1 A
封装主体材料:PLASTIC/EPOXY封装形状:SQUARE
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
认证状态:Not Qualified表面贴装:YES
技术:SCHOTTKY端子面层:MATTE TIN
端子形式:GULL WING端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIEDBase Number Matches:1

MXUPS5817E3TR13 数据手册

 浏览型号MXUPS5817E3TR13的Datasheet PDF文件第2页浏览型号MXUPS5817E3TR13的Datasheet PDF文件第3页浏览型号MXUPS5817E3TR13的Datasheet PDF文件第4页 
UPS5817e3 and UPS5819e3  
POWERMITE 1™ SURFACE MOUNT  
1 AMP 20 and 40 V SCHOTTKY RECTIFIERS  
S C O T T S D A L E D I V I S I O N  
DESCRIPTION  
APPEARANCE  
The UPS5817e3 and UPS5819e3 offer a small and powerful surface mount  
package that is RoHS compliant for a 1 Amp rated Schottky. These ratings  
are found only in much larger packages. They are ideal for surface mount  
applications that operate at high frequencies with their “hot carrier” features  
that provide extremely fast switching. The very low thermal resistance of the  
patented Powermite 1package design with a full metallic bottom and  
unique locking tab act as an efficient heat path to a heat sink mounting permitting  
cooler operating junction temperatures for minimal reverse leakage currents  
and lower power loss. It is also ideal for automatic insertion equipment.  
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com  
DO-216  
Powermite 1™  
FEATURES  
APPLICATIONS / BENEFITS  
Low profile DO-216 package (<1.1 mm)  
RoHS compliant with e3 suffix part number  
Small footprint area of 8.45 mm2  
High current capability with low forward voltage  
Guard-ring-die construction for transient protection  
Silicon Schottky (hot carrier) rectifier for minimal t  
and minimal reverse recovery voltage  
rr  
Plastic package has Underwriters Laboratory  
Flammability classification 94V-0  
Elimination of reverse-recovery oscillations to  
reduce need for EMI filtering  
Unique locking tab on bottom acts as integral efficient  
heat path to heat sink (mounting substrate)  
For use in high-frequency switching power supplies,  
inverters, free wheeling, charge pump circuits and  
polarity protection applications  
Metal to silicon rectifier, majority carrier conduction  
Options for screening in accordance with MIL-PRF-  
19500 for JAN, JANTX, and JANTXV are available by  
adding MQ, MX, or MV prefixes respectively to part  
numbers. For example, designate a MXUPS5819e3  
for a JANTX screen. Consult factory for Tin-Lead  
plating.  
Optional avionics screening available by adding MA  
prefix for 100% temperature cycling, thermal  
impedance testing, and 24 hours HTRB. For example,  
designate a MAUPS5819e3. Consult factory for Tin-  
Lead plating.  
Lower forward power loss and high efficiency  
Low inductive parasitics (<2nH) for minimal Ldi/dt  
effects  
Robust package configuration for pick-and-place  
handling  
Full-metallic bottom eliminates flux entrapment  
Small foot print with 0.100 x 0.160 inches (see  
mounting pad details on last page)  
MAXIMUM RATINGS  
MECHANICAL AND PACKAGING  
Storage temperature (TSTG): -55 oC to +150oC  
Terminals: Copper with annealed matte-Tin plating  
for RoHS compliance solderable per MIL-STD-750  
method 2026 (consult factory for Tin-Lead plating.)  
Polarity: Backside is cathode  
Marking: UPS5817e3 marked with S17•  
and UPS5819e3 marked with S19•  
Operating junction temperature (TJ ): -55 oC to +150oC  
Average forward rectified current (IO) @TC=100oC: 1.0  
Amp  
Forward surge current (IFSM) 8.3 ms single half-sine  
waveform superimposed on rated load (JEDEC  
Method): 50 Amps  
Thermal resistance junction to case (bottom): 10 oC/W  
Thermal resistance (RθJA): 240 oC/W on PCB with FR4  
using 1 oz Copper and recommended mounting pad  
size (see pad layout next page)  
Solder temperatures: 260 ºC for 10 s (maximum)  
Molded epoxy package meets UL94V-0  
Weight: 0.016 grams (approximate)  
Tape & Reel option: 12 mm tape per EIA-481-B  
3000 units on 7 inch reel and 12,000 on 13” reel  
(add TR7 or TR13 respectively to part number)  
See package dimensions on last page  
Copyright © 2007  
6-26-2007 REV C  
Microsemi  
Page 1  
Scottsdale Division  
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503  

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