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MXSMLJ75E3 PDF预览

MXSMLJ75E3

更新时间： 2024-11-12 18:34:31
品牌 Logo 应用领域
美高森美 - MICROSEMI 局域网光电二极管
页数 文件大小 规格书
4页 189K
描述
Trans Voltage Suppressor Diode, 3000W, 75V V(RWM), Unidirectional, 1 Element, Silicon, DO-214AB, ROHS COMPLIANT, PLASTIC PACKAGE-2

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MXSMLJ75E3 技术参数

是否Rohs认证：符合生命周期：Obsolete
零件包装代码：DO-214AB包装说明：R-PDSO-C2
针数：2Reach Compliance Code：unknown
ECCN代码：EAR99HTS代码：8541.10.00.50
风险等级：5.72Is Samacsys：N
最大击穿电压：102 V最小击穿电压：83.3 V
配置：SINGLE二极管元件材料：SILICON
二极管类型：TRANS VOLTAGE SUPPRESSOR DIODEJEDEC-95代码：DO-214AB
JESD-30 代码：R-PDSO-C2JESD-609代码：e3
湿度敏感等级：1最大非重复峰值反向功率耗散：3000 W
元件数量：1端子数量：2
封装主体材料：PLASTIC/EPOXY封装形状：RECTANGULAR
封装形式：SMALL OUTLINE峰值回流温度（摄氏度）：NOT SPECIFIED
极性：UNIDIRECTIONAL最大功率耗散：1.61 W
认证状态：Not Qualified参考标准：MIL-19500
最大重复峰值反向电压：75 V表面贴装：YES
技术：AVALANCHE端子面层：MATTE TIN
端子形式：C BEND端子位置：DUAL
处于峰值回流温度下的最长时间：NOT SPECIFIEDBase Number Matches：1

MXSMLJ75E3 数据手册

 浏览型号MXSMLJ75E3的Datasheet PDF文件第2页浏览型号MXSMLJ75E3的Datasheet PDF文件第3页浏览型号MXSMLJ75E3的Datasheet PDF文件第4页 
SMLJ5.0 thru SMLJ170CA, e3  
and SMLG5.0 thru SMLG170CA, e3  
SURFACE MOUNT 3000 Watt  
Transient Voltage Suppressor  
S C O T T S D A L E D I V I S I O N  
DESCRIPTION  
APPEARANCE  
The SMLJ5.0-170A or SMLG5.0-170A series of 3000 W Transient Voltage  
Suppressors (TVSs) protects a variety of voltage-sensitive components  
from destruction or degradation. It is available in J-bend design (SMLJ)  
with the DO-214AB package for greater PC board mounting density or in a  
Gull-wing design (SMLG) in the DO-215AB for visible solder connections.  
Selections include unidirectional and bidirectional. They can protect from  
secondary lightning effects per IEC61000-4-5 and class levels defined  
herein, or for inductive switching environments and induced RF protection.  
Since their response time is virtually instantaneous, they can also be used  
in protection from ESD and EFT per IEC61000-4-2 and IEC61000-4-4.  
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com  
FEATURES  
APPLICATIONS / BENEFITS  
•
•
Economical surface mount TVS design in both J-bend  
or Gull-wing terminations with fast response  
•
•
•
Suppresses transients up to 3000 watts @ 10/1000 µs  
Protection from switching transients and induced RF  
Available in both Unidirectional and Bidirectional  
construction with a C or CA suffix  
Protection from ESD, and EFT per IEC 61000-4-2 and  
IEC 61000-4-4  
•
•
Selections for 5.0 to 170 volts standoff voltages (VWM)  
•
Secondary lightning protection per IEC61000-4-5 with  
42 Ohms source impedance:  
Class 1 & 2: SML 5.0 to SML 170A or CA  
Class 3: SML 5.0 to SML 150A or CA  
Class 4: SML 5.0 to SML 75A or CA  
Optional 100% screening for avionics grade is  
available by adding MA prefix to part number for  
added 100% temperature cycle -55oC to +125oC (10X)  
as well as surge (3X) and 24 hours HTRB with post  
test VZ & IR (in the operating direction for unidirectional  
or both directions for bidirectional)  
•
Secondary lightning protection per IEC61000-4-5 with  
12 Ohms source impedance:  
Class 1: SML 5.0 to SML 170A or CA  
Class 2: SML 5.0 to SML 90A or CA  
Class 3: SML 5.0 to SML 48A or CA  
Class 4: SML 5.0 to SML 24A or CA  
•
•
Options for screening in accordance with MIL-PRF-  
19500 for JAN, JANTX, and JANTXV are available by  
adding MQ, MX, or MV prefixes respectively to part  
numbers  
Axial-lead packages for thru-hole mounting available  
as 5KP5.0–110A with 5000 W rating (consult factory  
for other surface mount options)  
•
Secondary lightning protection per IEC61000-4-5 with  
2 Ohms source impedance:  
•
•
RoHS Compliant devices available by adding e3 suffix  
Class 2: SML 5.0 to SML 43A or CA  
Class 3: SML 5.0 to SML 22A or CA  
Class 4: SML 5.0 to SML10A or CA  
Moisture classification is Level 1 with no dry pack  
required per IPC/JEDEC J-STD-020B  
MAXIMUM RATINGS  
• Peak Pulse Power dissipation at 25ºC: 3000 watts at  
10/1000 μs (also see Fig 1,2, and 3)  
MECHANICAL AND PACKAGING  
•
CASE: Void-free transfer molded thermosetting  
epoxy body meeting UL94V-0  
• Impulse repetition rate (duty factor): 0.01%  
•
TERMINALS: Gull-wing or C-bend (modified J-bend)  
leads with tin-lead or RoHS Compliant annealed  
matte-Tin plating solderable per MIL-STD-750,  
method 2026  
• tclamping (0 volts to V(BR) min.): < 100 ps theoretical for  
unidirectional and < 5 ns for bidirectional  
• Operating and Storage temperature: -65ºC to +150ºC  
•
•
POLARITY: Cathode indicated by band. No marking  
on bidirectional devices  
• Thermal resistance: 17.5ºC/W junction to lead, or  
77.5ºC/W junction to ambient when mounted on FR4  
PC board (1 oz Cu) with recommended footprint  
Steady-State Power dissipation: 6 watts at TL = 45oC,  
or 1.61 watts at TA = 25ºC when mounted on FR4 PC  
board with recommended footprint  
MARKING: Part number without SM and G or J prefix  
(e.g. L5.0, L5.0A, L5.0Ae3, L5.0CA, L36, L36A,  
L36Ae3, L36CAe3, etc.)  
•
•
TAPE & REEL option: Standard per EIA-481-2 with  
16 mm tape, 750 per 7 inch reel or 2500 per 13 inch  
reel (add “TR” suffix to part number)  
• Forward Surge at 25ºC: 200 Amps peak impulse of  
8.3 ms half-sine wave (unidirectional only)  
• Solder temperatures: 260 ºC for 10 s (maximum)  
WEIGHT: 0.25 grams  
Copyright © 2009  
4-06-2009 REV J  
Microsemi  
Page 1  
Scottsdale Division  
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503  
1234

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