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MXHSMBJ5956E3TR PDF预览

MXHSMBJ5956E3TR

更新时间: 2024-10-31 04:33:47
品牌 Logo 应用领域
美高森美 - MICROSEMI /
页数 文件大小 规格书
3页 124K
描述
Zener Diode, 200V V(Z), 20%, 1.56W, Silicon, Unidirectional, DO-214AA, ROHS COMPLIANT, PLASTIC PACKAGE-2

MXHSMBJ5956E3TR 数据手册

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HSMBJ5913 thru HSMBJ5956, e3  
SILICON 3.0 Watt ZENER DIODE  
S C O T T S D A L E D I V I S I O N  
DESCRIPTION  
PACKAGE  
The HSMBJ5913-5956B series of surface mount 3.0 watt Zeners provides  
voltage regulation in a selection from 3.3 to 200 volts with different tolerances  
as identified by suffix letter on the part number. It is equivalent to the JEDEC  
registered 1N5913 thru 1N5956B with identical electrical characteristics  
except it is rated at 3.0 W instead of 1.5 W with the lower thermal resistance  
features of this surface mount packaging. These plastic encapsulated Zeners  
have a moisture classification of Level 1 with no dry pack required and are  
also available in military equivalent screening levels by adding a prefix  
identifier as further described in the Features section. Microsemi also offers  
numerous other Zener products to meet higher and lower power applications.  
DO-214AA  
(see package notes)  
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com  
FEATURES  
APPLICATIONS / BENEFITS  
Surface mount equivalent to 1N5913 to  
1N5956B  
Regulates voltage over a broad operating current  
and temperature range  
Ideal for high-density and low-profile mounting  
Zener voltage available 3.3V to 200V  
Wide selection from 3.3 to 200 V  
Flexible axial-lead mounting terminals  
Standard voltage tolerances are plus/minus 5%  
with B suffix and 10 % with A suffix identification  
Nonsensitive to ESD per MIL-STD-750 Method  
1020  
Tight tolerances available in plus or minus 2% or  
1% with C or D suffix respectively  
High specified maximum current (IZM) when  
adequately heat sinking  
RoHS Compliant devices available by adding  
“e3’ suffix  
Moisture classification is Level 1 with no dry pack  
required per IPC/JEDEC J-STD-020B  
Options for screening in accordance with MIL-  
PRF-19500 for JAN, JANTX, JANTXV, and  
JANS are available by adding MQ, MX, MV, or  
MSP prefixes respectively to part numbers.  
MAXIMUM RATINGS  
MECHANICAL AND PACKAGING  
Power dissipation at 25ºC: 3.0 watts (also see  
derating in Figure 1).  
CASE: Void-free transfer molded thermosetting  
epoxy body meeting UL94V-0  
Operating and Storage temperature: -65ºC to  
TERMINALS: C-bend (modified J-bend) leads, Tin-  
Lead or RoHS Compliant annealed matte-Tin  
plating solderable per MIL-STD-750, method 2026  
+150ºC  
Thermal Resistance: 15 ºC/W junction to lead,  
or 80ºC/W junction to ambient when mounted on  
FR4 PC board (1oz Cu) with recommended  
footprint (see last page)  
POLARITY: Cathode indicated by band. Diode to  
be operated with the banded end positive with  
respect to the opposite end for Zener regulation  
Steady-State Power: 3 watts at TL < 105oC, or  
1.56 watts at TA = 25ºC when mounted on FR4  
PC board with recommended footprint (also see  
Figure1)  
MARKING: Includes part number without prefix  
(e.g. 5913B, 5926C, 5951D, etc.)  
TAPE & REEL option: Standard per EIA-481-1-A  
with 12 mm tape 750 per 7 inch reel or 2500 per 13  
inch reel (add “TR” suffix to part number)  
Forward voltage @200 mA: 1.2 volts  
(maximum)  
Solder Temperatures: 260 ºC for 10 s  
(maximum)  
WEIGHT: 0.1 grams  
See package dimensions on last page  
Copyright © 2006  
3-12-2006 REV G  
Microsemi  
Page 1  
Scottsdale Division  
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503  

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