MwT-S7
18 GHz High Gain, Low Noise
GaAs FET
DOWNLOAD ADDITIONAL DATA WWW.MWTINC.COM
CHIP THICKNESS = 125
50
All Dimensions in Microns
50
FEATURES
• HIGH AVAILABLE GAIN WHEN BIASED FOR LOW-NOISE
• EXCELLENT FOR BROADBAND GAIN OR OSCILLATOR BUFFER
APPLICATIONS
• 0.3 MICRON REFRACTORY METAL/GOLD GATE
• 250 MICRON GATE WIDTH
70
241
100
• CHOICE OF CHIP AND TWO PACKAGE TYPES
50
50
50
50
356
DESCRIPTION
The MwT-S7 is a GaAs MESFET device whose nominal quarter-micron gate length and 250 micron gate width make it ideally suited to
applications requiring high-gain in the 500 MHz to 18 GHz frequency range while exhibiting a low noise figure. The straight geometry of
the MwT-S7 makes it equally effective for either wideband (e.g. 6 to 18 GHz) or narrow-band applications. Procesing which guarantees
low phase noise makes the MwT-S7 particularly attractive for oscillator applications. The chip is produced using MwT’s reliable metal
system and devices from each wafer are screened to insure reliability. All chips are passivated using MwT’s patented “Diamond-Like
Carbon” process for increased durability, Designers can use MwT’s unique BIN selection feature to choose devices from narrow Idss
ranges, insuring consistent circuit operation.
DC SPECIFICATIONS AT Ta = 25°C
RF SPECIFICATIONS AT Ta = 25°C
SYMBOL
PARAM. & CONDITIONS
UNITS
MIN
TYP
MAX
98
SYMBOL
PARAMETERS AND CONDITIONS
FREQ
UNITS
MIN TYP
Output Power at 1 dB Compression
VDS= 4.5 V Idss= 0.6 IDS=30mA
Saturated Drain Current
Vds= 4.0 V VGS= 0.0 V
Transconductance
P1dB
12 GHz
dBm
16.0
IDSS
mA
26
Small Signal Gain
VDS= 4.5 V Idss= 0.6 IDS=30mA
Gm
mS
V
45
60
SSG
12 GHz
12 GHz
dB
dB
10.0 11.0
1.5
Vds= 2.0 V VGS= 0.0 V
Pinch-off Voltage
-1.5
-7.0
Vp
-4.5
Optimum Noise Figure
VDS= 3.0V IDS= 10mA
NFopt
Vds= 3.0 V IDS= 5.0 mA
Gate-to-Source Breakdown Volt.
Igs= -1.0 mA
BVGSO
V
-4.0
-5.0
Gain at Optimum Noise Figure
VDS= 3.0V IDS= 10mA
GA
12 GHz
dB
7.0
8.0
Gate-to-Drain Breakdown Volt.
Igd= -1.0 mA
BVGDO
Rth
V
-7.0
Recommended IDSS Range
for Optimum P1dB
34-
70
IDSS
mA
Thermal
Resistance MwT-S770, S773
180
380*
MwT-S7 Chip,
°C/W
*Overall Rth depends on case mounting.
PARAMETER
DEVICE EQUIVALENT CIRCUIT MODEL
VALUE
2.6 Ω
Cgd
Lg
Rg
Rd
Ld
Source Resistance
Rs
Source Inductance
Ls
0.025
173
nH
Ω
pF
Ω
pF
nH
nH
pF
Ω
Drain-Source Resistance
Drain-Source Capacitance
Drain Resistance
Drain Pad Capacitance
Drain Inductance
Gate Bond Wire Inductance
Gate Pad Capacitance
Gate Resistance
Rds
Cds
Rd
Cpd
Ld
Lg
Cpg
Rg
GATE
DRAIN
Cgs
Ri
Rds
0.07
3.67
0.027
0.159
0.13
0.05
0.2
gm
tau
Cds
Cpd
Cpg
Rs
Ls
Cgs
Ri
Cgd
gm
tau
0.314
6.9
0.027
69.0
2.0
pF
Ω
pF
mS
psec
Gate-Source Capacitance
Channel Resistance
Gate-Drain Capacitance
Transconductance
SOURCE
Transit Time
ORDERING INFORMATION
Chip
MwT-S7
NOTE:
Package 71
Package 73
MwT-S771
MwT-S773
For Package information, please see supplimentary application note from our website at
www.mwtinc.com. When placing order or inquiring, please specify BIN range, wafer no., if
known, and screening level required.
4268 Solar Way Fremont California 94538 Phone: (510) 651-6700 Fax: (510) 651-2208
All rights reserved. MicroWave Technology, Inc. All specifications subject to change without notice.