MGSF1N02L, MVGSF1N02L
Power MOSFET
750 mAmps, 20 Volts
N−Channel SOT−23
These miniature surface mount MOSFETs low R
assure
DS(on)
www.onsemi.com
minimal power loss and conserve energy, making these devices ideal
for use in space sensitive power management circuitry. Typical
applications are dc−dc converters and power management in portable
and battery−powered products such as computers, printers, PCMCIA
cards, cellular and cordless telephones.
750 mAMPS, 20 VOLTS
RDS(on) = 90 mW
N−Channel
Features
3
• Low R
Provides Higher Efficiency and Extends Battery Life
• Miniature SOT−23 Surface Mount Package Saves Board Space
DS(on)
• MVGSF Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable*
1
• These Devices are Pb−Free and are RoHS Compliant
2
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
MARKING DIAGRAM/
PIN ASSIGNMENT
Rating
Symbol
Value
Unit
Drain−to−Source Voltage
V
20
Vdc
DSS
3
Drain
Gate−to−Source Voltage − Continuous
V
20
Vdc
GS
1
Drain Current
SOT−23
CASE 318
STYLE 21
N2 M G
I
750
2000
mA
− Continuous @ T = 25°C
− Pulsed Drain Current (t ≤ 10 ms)
D
A
G
I
DM
p
Total Power Dissipation @ T = 25°C
P
400
− 55 to 150
300
mW
°C
A
D
1
2
Gate
Source
Operating and Storage Temperature Range T , T
J
stg
Thermal Resistance, Junction−to−Ambient
R
°C/W
°C
N2
M
G
= Device Code
= Date Code*
= Pb−Free Package
q
JA
Maximum Lead Temperature for Soldering
Purposes, 1/8″ from case for 10 seconds
T
260
L
(Note: Microdot may be in either location)
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
*Date Code orientation and overbar may vary
depending upon manufacturing location.
ORDERING INFORMATION
†
Device
Package
Shipping
MGSF1N02LT1G
SOT−23
(Pb−Free)
3000 / Tape &
Reel
MVGSF1N02LT1G*
SOT−23
(Pb−Free)
3000 / Tape &
Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 1996
1
Publication Order Number:
October, 2016 − Rev. 7
MGSF1N02LT1/D