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MURD530_11 PDF预览

MURD530_11

更新时间: 2024-09-27 10:41:51
品牌 Logo 应用领域
安森美 - ONSEMI 开关
页数 文件大小 规格书
5页 98K
描述
SWITCHMODE Power Rectifier

MURD530_11 数据手册

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MURD530  
SWITCHMODE  
Power Rectifier  
DPAK Surface Mount Package  
http://onsemi.com  
These stateoftheart devices are designed for use in switching  
power supplies, inverters and as free wheeling diodes.  
ULTRAFAST RECTIFIER  
5.0 AMPERES, 300 VOLTS  
Features  
Ultrafast 50 Nanosecond Recovery Time  
Low Forward Voltage Drop  
Low Leakage  
1
4
PbFree Package is Available  
3
Mechanical Characteristics  
Case: Epoxy, Molded  
MARKING  
DIAGRAM  
Weight: 0.4 Gram (Approximately)  
Finish: All External Surfaces Corrosion Resistant and Terminal  
Leads are Readily Solderable  
4
AYWW  
U
530G  
DPAK  
CASE 369C  
Lead and Mounting Surface Temperature for Soldering Purposes:  
2
1
3
260°C Max. for 10 Seconds  
A
Y
= Assembly Location  
= Year  
Available in 16 mm Tape and Reel, 2500 Units Per Reel,  
by Adding a “T4’’ Suffix to the Part Number  
WW = Work Week  
G
= PbFree Package  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
Unit  
ORDERING INFORMATION  
Peak Repetitive Reverse Voltage  
Working Peak Reverse Voltage  
DC Blocking Voltage  
V
V
V
300  
V
RRM  
RWM  
Device  
MURD530T4G  
Package  
Shipping  
R
DPAK  
2500/Tape & Reel  
Average Rectified Forward Current  
I
5.0  
10  
A
A
F(AV)  
(PbFree)  
(Rated V , T = 165°C)  
R
C
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
Peak Repetitive Forward Current  
(Rated V , Square Wave,  
I
FRM  
R
20 kHz, T = 165°C)  
C
NonRepetitive Peak Surge Current  
(Surge Applied at Rated Load  
Conditions Halfwave, 60 Hz)  
I
75  
A
FSM  
Operating Junction and Storage  
Temperature Range  
T , T  
65 to +175  
°C  
J
stg  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
© Semiconductor Components Industries, LLC, 2011  
1
Publication Order Number:  
January, 2011 Rev. 3  
MURD530/D  

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