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MURA130T3_06 PDF预览

MURA130T3_06

更新时间: 2024-11-17 12:27:39
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
4页 48K
描述
Surface Mount Ultrafast Power Rectifiers

MURA130T3_06 数据手册

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MURA130T3, MURA140T3  
Preferred Devices  
Surface Mount  
Ultrafast Power Rectifiers  
Ideally suited for high voltage, high frequency rectification, or as  
free wheeling and protection diodes in surface mount applications  
where compact size and weight are critical to the system.  
http://onsemi.com  
Features  
Small Compact Surface Mountable Package with J−Bend Leads  
Rectangular Package for Automated Handling  
ULTRAFAST RECTIFIERS  
1 AMPERE, 300−400 VOLTS  
High Temperature Glass Passivated Junction  
Low Forward Voltage Drop (0.8 V Max @ 1.0 A, T = 150°C)  
J
Pb−Free Packages are Available  
Mechanical Characteristics:  
Case: Epoxy, Molded  
SMA  
CASE 403D  
PLASTIC  
Weight: 70 mg (Approximately)  
Finish: All External Surfaces Corrosion Resistant and Terminal  
Leads are Readily Solderable  
Lead and Mounting Surface Temperature for Soldering Purposes:  
260°C Max. for 10 Seconds  
MARKING DIAGRAM  
Polarity: Polarity Band Indicates Cathode Lead  
ESD Protection: Human Body Model > 4000 V (Class 3)  
Machine Model > 400 V (Class C)  
U4x  
AYWW G  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
Unit  
Peak Repetitive Reverse Voltage  
Working Peak Reverse Voltage  
V
V
U4x = Device Code  
x = F for MURA130T3  
= G for MURA140T3  
RRM  
V
RWM  
V
DC Blocking Voltage  
MURA130T3  
MURA140T3  
300  
400  
R
A
Y
= Assembly Location  
= Year  
Average Rectified Forward Current  
I
A
A
F(AV)  
WW = Work Week  
@ T = 150°C  
1.0  
2.0  
L
@ T = 125°C  
G
= Pb−Free Package  
L
Non-Repetitive Peak Surge Current  
(Surge Applied at Rated Load Condtions  
Halfwave, Single Phase, 60 Hz)  
I
35  
FSM  
ORDERING INFORMATION  
Device  
Package  
Shipping  
Operating Junction Temperature Range  
T
J
−65 to +175 °C  
MURA130T3  
SMA  
5000/Tape & Reel  
5000/Tape & Reel  
THERMAL CHARACTERISTICS  
MURA130T3G  
SMA  
(Pb−Free)  
Characteristic  
Symbol  
Max  
Unit  
Thermal Resistance, Junction−to−Lead  
Psi  
24  
°C/W  
JL  
(T = 25°C) (Note 1)  
(Note 2)  
MURA140T3  
SMA  
5000/Tape & Reel  
5000/Tape & Reel  
L
Thermal Resistance, Junction−to−Ambient  
(Note 1)  
R
216  
θ
JA  
MURA140T3G  
SMA  
(Pb−Free)  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits are  
exceeded, device functional operation is not implied, damage may occur and  
reliability may be affected.  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
1. Rating applies when surface mounted on the minimum pad size recommended,  
PC Board FR−4.  
Preferred devices are recommended choices for future use  
and best overall value.  
2. In compliance with JEDEC 51, these values (historically represented by R  
)
θ
JL  
are now referenced as Psi  
.
JL  
© Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
February, 2006 − Rev. 4  
MURA130T3/D  
 

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