8Mb: 512K x 18, 256K x 32/36
FLOW-THROUGH SYNCBURST SRAM
8Mb SYNCBURST™
SRAM
MT58L512L18F, MT58L256L32F,
MT58L256L36F; MT58L512V18F,
MT58L256V32F, MT58L256V36F
3.3V VDD, 3.3V or 2.5V I/O, Flow-Through
FEATURES
• Fast clock and OE# access times
• Single +3.3V +0.3V/-0.165V power supply (VDD)
• Separate +3.3V or +2.5V isolated output buffer
supply (VDDQ)
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100-Pin TQFP
• SNOOZE MODE for reduced-power standby
• Common data inputs and data outputs
• Individual BYTE WRITE control and GLOBAL WRITE
• Three chip enables for simple depth expansion and
address pipelining
• Clock-controlled and registered addresses, data I/Os
and control signals
• Internally self-timed WRITE cycle
• Burst control (interleaved or linear burst)
• Automatic power-down for portable applications
• 100-pin TQFP package
165-Pin FBGA
• 165-pin FBGA
• Low capacitive bus loading
• x18, x32, and x36 versions available
OPTIONS
MARKING
• Timing (Access/Cycle/MHz)
7.5ns/8.8ns/113 MHz
8.5ns/10ns/100 MHz
10ns/15ns/66 MHz
-7.5
-8.5
-10
NOTE:1. JEDEC-standard MS-026 BHA (LQFP).
• Configurations
3.3V I/O
512K x 18
256K x 32
256K x 36
2.5V I/O
MT58L512L18F
MT58L256L32F
MT58L256L36F
* A Part Marking Guide for the FBGA devices can be found on Micron’s
Web site—http://www.micron.com/support/index.html.
** Industrial temperature range offered in specific speed grades and
configurations. Contact factory for more information.
512K x 18
256K x 32
256K x 36
MT58L512V18F
MT58L256V32F
MT58L256V36F
GENERAL DESCRIPTION
TheMicron® SyncBurst™ SRAMfamilyemployshigh-
speed, low-power CMOS designs that are fabricated us-
ing an advanced CMOS process.
• Packages
100-pin TQFP (2-chip enable)
100-pin TQFP (3-chip enable)
165-pin, 13mm x 15mm FBGA
T
S
F*
Micron’s 8Mb SyncBurst SRAMs integrate a 512K x 18,
256K x 32, or 256K x 36 SRAM core with advanced syn-
chronous peripheral circuitry and a 2-bit burst counter.
All synchronous inputs pass through registers controlled
by a positive-edge-triggered single-clock input (CLK).
The synchronous inputs include all addresses, all data
inputs, active LOW chip enable (CE#), two additional
chip enables for easy depth expansion (CE2#, CE2), burst
control inputs (ADSC#, ADSP#, ADV#), byte write
• Operating Temperature Range
Commercial (0°C to +70°C)
Industrial (-40°C to +85°C)**
None
IT
Part Number Example:
MT58L256V36FT-10
8Mb: 512K x 18, 256K x 32/36 Flow-Through SyncBurst SRAM
MT58L512L18F_C.p65 – Rev. 2/02
Micron Technology, Inc., reserves the right to change products or specifications without notice.
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©2002, Micron Technology, Inc.