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MT58L128L36P1B-6 PDF预览

MT58L128L36P1B-6

更新时间: 2024-01-14 02:15:08
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 静态存储器内存集成电路
页数 文件大小 规格书
35页 353K
描述
Standard SRAM, 128KX36, 3.5ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, MS-028BHA, BGA-119

MT58L128L36P1B-6 技术参数

生命周期:Transferred零件包装代码:BGA
包装说明:BGA,针数:119
Reach Compliance Code:unknownECCN代码:3A991.B.2.A
HTS代码:8542.32.00.41风险等级:5.56
Is Samacsys:N最长访问时间:3.5 ns
JESD-30 代码:R-PBGA-B119JESD-609代码:e1
长度:22 mm内存密度:4718592 bit
内存集成电路类型:STANDARD SRAM内存宽度:36
功能数量:1端子数量:119
字数:131072 words字数代码:128000
工作模式:SYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:128KX36
封装主体材料:PLASTIC/EPOXY封装代码:BGA
封装形状:RECTANGULAR封装形式:GRID ARRAY
并行/串行:PARALLEL认证状态:Not Qualified
座面最大高度:2.4 mm最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):3.135 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:TIN SILVER COPPER
端子形式:BALL端子节距:1.27 mm
端子位置:BOTTOM宽度:14 mm
Base Number Matches:1

MT58L128L36P1B-6 数据手册

 浏览型号MT58L128L36P1B-6的Datasheet PDF文件第2页浏览型号MT58L128L36P1B-6的Datasheet PDF文件第3页浏览型号MT58L128L36P1B-6的Datasheet PDF文件第4页浏览型号MT58L128L36P1B-6的Datasheet PDF文件第5页浏览型号MT58L128L36P1B-6的Datasheet PDF文件第6页浏览型号MT58L128L36P1B-6的Datasheet PDF文件第7页 
4Mb : 256K x 18, 128K x 32/36  
PIPELINED, SCD SYNCBURST SRAM  
4Mb SYNCBURST™  
SRAM  
MT58L256L18P1, MT58L128L32P1,  
MT58L128L36P1; MT58L256V18P1,  
MT58L128V32P1, MT58L128V36P1  
3.3V VDD, 3.3V o r 2.5V I/O, Pip e lin e d , Sin g le -Cycle  
De se le ct  
FEATURES  
1
100-Pin TQFP  
• Fast clock an d OE# access tim es  
• Sin gle +3.3V +0.3V/-0.165V power supply (VDD  
• Separate +3.3V or +2.5V isolated output buffer  
supply (VDDQ)  
)
• SNOOZE MODE for reduced-power stan dby  
• Single-cycle deselect (Pentium® BSRAM-com patible)  
• Com m on data in puts an d data outputs  
• Individual BYTE WRITE control and GLOBAL WRITE  
• Th ree ch ip en ables for sim ple depth expan sion  
an d address pipelin in g  
• Clock-con trolled an d registered addresses, data  
I/Os an d con trol sign als  
• In tern ally self-tim ed WRITE cycle  
• Burst con trol pin (in terleaved or lin ear burst)  
• Autom atic power-down for portable application s  
• 165-pin FBGA package  
165-Pin FBGA  
(Preliminary Package Data)  
• 100-pin TQFP package  
• 119-pin BGA package  
• Low capacitive bus loadin g  
• x18, x32, an d x36 version s available  
OPTIONS  
MARKING  
• Tim in g (Access/Cycle/MHz)  
2.3n s/4n s/250 MHz  
2.6n s/4.4n s/225 MHz  
3.1n s/5n s/200 MHz  
3.5n s/6n s/166 MHz  
4.0n s/7.5n s/133 MHz  
5n s/10n s/100 MHz  
Con figuration s  
3.3V I/O  
-4  
-4.4  
-5  
-6  
-7.5  
-10  
2
119-Pin BGA  
256K x 18  
128K x 32  
128K x 36  
MT58L256L18P1  
MT58L128L32P1  
MT58L128L36P1  
2.5V I/O  
256K x 18  
128K x 32  
128K x 36  
MT58L256V18P1  
MT58L128V32P1  
MT58L128V36P1  
• Packages  
100-pin TQFP  
165-pin FBGA  
T
F*  
B
NOTE: 1. JEDEC-standard MS-026 BHA (LQFP).  
119-pin , 14m m x 22m m BGA  
Operatin g Tem perature Ran ge  
Com m ercial (0°C to +70°C)  
In dustrial (-40°C to +85°C)**  
Part Number Example:  
2. JEDEC-standard MS-028 BHA(PBGA).  
Non e  
IT  
* A Part Markin g Guide for th e FBGA devices can be foun d on Micron s  
Web site—h ttp://www.m icron .com /support/in dex.h tm l.  
** In dustrial tem perature ran ge offered in specific speed grades an d  
con figuration s. Con tact factory for m ore in form ation .  
MT58L256L18P1T-6  
4Mb: 256K x 18, 128K x 32/36 Pipelined, SCD SyncBurst SRAM  
MT58L256L18P1_D.p65 – Rev. 10/01  
Micron Technology, Inc., reservesthe right to change productsor specificationswithout notice.  
1
©2001, Micron Technology, Inc.  

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