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MT58L128L18DT-10IT PDF预览

MT58L128L18DT-10IT

更新时间: 2024-02-22 13:08:36
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 静态存储器内存集成电路
页数 文件大小 规格书
17页 308K
描述
Cache SRAM, 128KX18, 5ns, CMOS, PQFP100, PLASTIC, MS-026BHA, TQFP-100

MT58L128L18DT-10IT 技术参数

生命周期:Obsolete零件包装代码:QFP
包装说明:LQFP,针数:100
Reach Compliance Code:unknownECCN代码:3A991.B.2.A
HTS代码:8542.32.00.41风险等级:5.45
最长访问时间:5 nsJESD-30 代码:R-PQFP-G100
长度:20 mm内存密度:2359296 bit
内存集成电路类型:CACHE SRAM内存宽度:18
功能数量:1端子数量:100
字数:131072 words字数代码:128000
工作模式:SYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:128KX18
封装主体材料:PLASTIC/EPOXY封装代码:LQFP
封装形状:RECTANGULAR封装形式:FLATPACK, LOW PROFILE
并行/串行:PARALLEL认证状态:Not Qualified
座面最大高度:1.6 mm最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):3.135 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子形式:GULL WING
端子节距:0.65 mm端子位置:QUAD
宽度:14 mmBase Number Matches:1

MT58L128L18DT-10IT 数据手册

 浏览型号MT58L128L18DT-10IT的Datasheet PDF文件第3页浏览型号MT58L128L18DT-10IT的Datasheet PDF文件第4页浏览型号MT58L128L18DT-10IT的Datasheet PDF文件第5页浏览型号MT58L128L18DT-10IT的Datasheet PDF文件第7页浏览型号MT58L128L18DT-10IT的Datasheet PDF文件第8页浏览型号MT58L128L18DT-10IT的Datasheet PDF文件第9页 
2Mb: 128K x 18, 64K x 32/36  
PIPELINED, DCD SYNCBURST SRAM  
TQFP PIN DESCRIPTIONS (continued)  
x18  
x32/x36  
SYMBOL  
TYPE  
DESCRIPTION  
84  
84  
ADSP#  
Input Synchronous Address Status Processor: This active LOW input  
interrupts any ongoing burst, causing a new external address to be  
registered. A READ is performed using the new address,  
independent of the byte write enables and ADSC#, but dependent  
upon CE#, CE2 and CE2#. ADSP# is ignored if CE# is HIGH. Power-  
down state is entered if CE2 is LOW or CE2# is HIGH.  
85  
85  
ADSC#  
MODE  
Input Synchronous Address Status Controller: This active LOW input  
interrupts any ongoing burst, causing a new external address to be  
registered. A READ or WRITE is performed using the new address if  
CE# is LOW. ADSC# is also used to place the chip into power-down  
state when CE# is HIGH.  
31  
31  
Input Mode: This input selects the burst sequence. A LOW on this pin  
selects “linear burst.” NC or HIGH on this pin selects “interleaved  
burst.” Do not alter input state while device is operating.  
(a) 58, 59,  
62, 63, 68, 69, 56-59, 62, 63  
72, 73  
(a) 52, 53,  
DQa  
DQb  
Input/ SRAM Data I/Os: For the x18 version, Byte “a” is DQa pins; Byte “b”  
Output is DQb pins. For the x32 and x36 versions, Byte “a” is DQa pins;  
Byte “b” is DQb pins; Byte “c” is DQc pins; Byte “d” is DQd pins. Input  
data must meet setup and hold times around the rising edge of CLK.  
(b) 8, 9, 12,  
(b) 68, 69,  
13, 18, 19, 72-75, 78, 79  
22, 23  
(c) 2, 3, 6-9,  
12, 13  
(d) 18, 19,  
DQc  
DQd  
22-25, 28, 29  
74  
24  
51  
80  
1
NC/DQPa NC/ No Connect/Parity Data I/Os: On the x32 version, these pins are No  
NC/DQPb  
NC/DQPc  
NC/DQPd  
I/O  
Connect (NC). On the x18 version, Byte “a” parity is DQPa; Byte “b”  
parity is DQPb. On the x36 version, Byte “a” parity is DQPa; Byte “b”  
parity is DQPb; Byte “c” parity is DQPc; Byte “d” parity is DQPd.  
30  
14, 15, 41, 65, 14, 15, 41, 65,  
91 91  
VDD  
VDDQ  
VSS  
Supply Power Supply: See DC Electrical Characteristics and Operating  
Conditions for range.  
4, 11, 20, 27, 4, 11, 20, 27,  
54, 61, 70, 77 54, 61, 70, 77  
Supply Isolated Output Buffer Supply: See DC Electrical Characteristics and  
Operating Conditions for range.  
5, 10, 17, 21, 5, 10, 17, 21,  
26, 40, 55, 60, 26, 40, 55, 60,  
67, 71, 76, 90 67, 71, 76, 90  
Supply Ground: GND.  
38, 39, 42, 43 38, 39, 42, 43  
DNU  
NC  
Do Not Use: These signals may either be unconnected or wired to  
GND to improve package heat dissipation.  
1-3, 6, 7, 16,  
25, 28-30,  
16, 66  
No Connect: These signals are not internally connected and may be  
connected to ground to improve package heat dissipation.  
51-53, 56, 57,  
66, 75, 78, 79,  
95, 96  
50  
50  
NC/SA  
No Connect: This pin is reserved for address expansion.  
2Mb: 128K x 18, 64K x 32/36 Pipelined, DCD SyncBurst SRAM  
MT58L128L18D.p65 – Rev. 9/99  
Micron Technology, Inc., reserves the right to change products or specifications without notice.  
6
1999, Micron Technology, Inc.  

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