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MSP430F2272IRHA PDF预览

MSP430F2272IRHA

更新时间： 2024-12-01 05:27:03
品牌 Logo 应用领域
德州仪器 - TI 微控制器和处理器外围集成电路时钟
页数 文件大小 规格书
87页 1774K
描述
MIXED SIGNAL MICROCONTROLLER

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MSP430F2272IRHA 技术参数

生命周期：Obsolete零件包装代码：QFN
包装说明：GREEN, PLASTIC, MO-220VJJD-2, VQFN-40针数：40
Reach Compliance Code：unknownHTS代码：8542.31.00.01
风险等级：5.21Is Samacsys：N
具有ADC：YES其他特性：ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 4.15 MHZ
地址总线宽度：位大小：16
CPU系列：MSP430最大时钟频率：16 MHz
DAC 通道：NODMA 通道：NO
外部数据总线宽度：JESD-30 代码：S-PQCC-N40
JESD-609代码：e4长度：6 mm
I/O 线路数量：32端子数量：40
最高工作温度：85 °C最低工作温度：-40 °C
PWM 通道：YES封装主体材料：PLASTIC/EPOXY
封装代码：HVQCCN封装等效代码：LCC40,.24SQ,20
封装形状：SQUARE封装形式：CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
电源：2/3.3 V认证状态：Not Qualified
RAM（字节）：1024ROM（单词）：32768
ROM可编程性：FLASH座面最大高度：1 mm
速度：16 MHz子类别：Microcontrollers
最大压摆率：0.55 mA最大供电电压：3.6 V
最小供电电压：1.8 V标称供电电压：2.2 V
表面贴装：YES技术：BIPOLAR
温度等级：INDUSTRIAL端子面层：NICKEL PALLADIUM GOLD
端子形式：NO LEAD端子节距：0.5 mm
端子位置：QUAD宽度：6 mm
uPs/uCs/外围集成电路类型：MICROCONTROLLER, RISCBase Number Matches：1

MSP430F2272IRHA 数据手册

 浏览型号MSP430F2272IRHA的Datasheet PDF文件第2页浏览型号MSP430F2272IRHA的Datasheet PDF文件第3页浏览型号MSP430F2272IRHA的Datasheet PDF文件第4页浏览型号MSP430F2272IRHA的Datasheet PDF文件第5页浏览型号MSP430F2272IRHA的Datasheet PDF文件第6页浏览型号MSP430F2272IRHA的Datasheet PDF文件第7页 
ꢀ ꢁꢂꢃ ꢄ ꢅ ꢆ ꢇ ꢇ ꢆ ꢇꢈ ꢀ ꢁꢂ ꢃꢄ ꢅꢆ ꢇꢇꢆ ꢃ  
ꢀ ꢉꢊꢋ ꢌ ꢁꢉ ꢍ ꢎꢏꢐ ꢀ ꢉꢑꢒꢓ ꢑꢓ ꢎꢔ ꢒꢓ ꢐꢐ ꢋꢒ  
SLAS504A − JULY 2006 − REVISED DECEMBER 2006  
D
D
Low Supply Voltage Range 1.8 V to 3.6 V  
D
Two Configurable Operational Amplifiers  
(MSP430x22x4 only)  
Ultralow-Power Consumption  
− Active Mode: 270 µA at 1 MHz, 2.2 V  
− Standby Mode: 0.7 µA  
− Off Mode (RAM Retention): 0.1 µA  
Ultrafast Wake-Up From Standby Mode in  
Less Than 1 µs  
16-Bit RISC Architecture, 62.5 ns  
Instruction Cycle Time  
D
Brownout Detector  
D
Serial Onboard Programming,  
No External Programming Voltage Needed  
Programmable Code Protection by  
Security Fuse  
D
D
D
D
D
D
Bootstrap Loader  
On Chip Emulation Module  
Basic Clock Module Configurations:  
− Internal Frequencies up to 16MHz With  
Four Calibrated Frequencies to 1%  
− Internal Very Low Power LF Oscillator  
− 32-kHz Crystal  
− High-Frequency Crystal up to 16 MHz  
− Resonator  
− External Digital Clock Source  
− External resistor  
Family Members Include:  
MSP430F2232: 8KB + 256B Flash Memory  
512B RAM  
MSP430F2252: 16KB + 256B Flash Memory  
512B RAM  
MSP430F2272: 32KB + 256B Flash Memory  
1KB RAM  
MSP430F2234: 8KB + 256B Flash Memory  
512B RAM  
D
D
D
16-Bit Timer_A With Three  
Capture/Compare Registers  
MSP430F2254: 16KB + 256B Flash Memory  
512B RAM  
MSP430F2274: 32KB + 256B Flash Memory  
1KB RAM  
Available in a 38-Pin Plastic Small-Outline  
Thin (TSSOP) Package and 40-Pin QFN  
Package  
For Complete Module Descriptions, Refer  
to the MSP430x2xx Family User’s Guide  
16-Bit Timer_B With Three  
Capture/Compare Registers  
Universal Serial Communication Interface  
− Enhanced UART supporting  
Auto-Baudrate Detection (LIN)  
− IrDA Encoder and Decoder  
− Synchronous SPI  
D
− I2Ct  
D
10-Bit, 200-ksps A/D Converter With  
Internal Reference, Sample-and-Hold,  
Autoscan, and Data Transfer Controller  
description  
The Texas Instruments MSP430 family of ultralow-power microcontrollers consist of several devices featuring  
different sets of peripherals targeted for various applications. The architecture, combined with five low-power  
modes is optimized to achieve extended battery life in portable measurement applications. The device features  
a powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code  
efficiency. The digitally controlled oscillator (DCO) allows wake-up from low-power modes to active mode in less  
than 1 µs.  
The MSP430x22xx series is an ultralow-power mixed signal microcontroller with two built-in 16-bit timers, a  
universal serial communication interface, 10-bit A/D converter with integrated reference and data transfer  
controller (DTC), two general purpose operational amplifiers in the MSP430x22x4 devices, and 32 I/O pins.  
Typical applications include sensor systems that capture analog signals, convert them to digital values, and then  
process the data for display or for transmission to a host system. Stand alone RF sensor front end is another  
area of application.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
ꢂꢒ ꢓ ꢌꢕ ꢑ ꢔꢉ ꢓ ꢎ ꢌ ꢏꢔꢏ ꢖꢗ ꢘ ꢙꢚ ꢛ ꢜꢝ ꢖꢙꢗ ꢖꢞ ꢟꢠ ꢚ ꢚ ꢡꢗꢝ ꢜꢞ ꢙꢘ ꢢꢠꢣ ꢤꢖꢟ ꢜꢝ ꢖꢙꢗ ꢥꢜ ꢝꢡ ꢦ  
ꢂꢚ ꢙ ꢥꢠꢟ ꢝ ꢞ ꢟ ꢙꢗ ꢘꢙ ꢚ ꢛ ꢝ ꢙ ꢞ ꢢꢡ ꢟ ꢖꢘ ꢖꢟꢜ ꢝꢖ ꢙꢗꢞ ꢢꢡ ꢚ ꢝꢧ ꢡ ꢝꢡ ꢚ ꢛꢞ ꢙꢘ ꢔꢡꢆ ꢜꢞ ꢉꢗꢞ ꢝꢚ ꢠꢛ ꢡꢗꢝ ꢞ  
ꢞ ꢝ ꢜ ꢗꢥ ꢜ ꢚꢥ ꢨ ꢜ ꢚꢚ ꢜ ꢗ ꢝꢩꢦ ꢂꢚ ꢙ ꢥꢠꢟ ꢝꢖꢙꢗ ꢢꢚ ꢙꢟ ꢡꢞ ꢞꢖ ꢗꢪ ꢥꢙꢡ ꢞ ꢗꢙꢝ ꢗꢡ ꢟꢡ ꢞꢞ ꢜꢚ ꢖꢤ ꢩ ꢖꢗꢟ ꢤꢠꢥ ꢡ  
ꢝ ꢡ ꢞ ꢝꢖ ꢗꢪ ꢙꢘ ꢜ ꢤꢤ ꢢꢜ ꢚ ꢜ ꢛ ꢡ ꢝ ꢡ ꢚ ꢞ ꢦ  
Copyright 2006 Texas Instruments Incorporated  
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
1234567...87

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