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MSP430F2274IYFFT PDF预览

MSP430F2274IYFFT

更新时间: 2024-12-01 12:02:15
品牌 Logo 应用领域
德州仪器 - TI 微控制器
页数 文件大小 规格书
95页 1891K
描述
MIXED SIGNAL MICROCONTROLLER

MSP430F2274IYFFT 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:BGA
包装说明:VFBGA, BGA49,7X7,16针数:49
Reach Compliance Code:compliantHTS代码:8542.31.00.01
风险等级:5.19具有ADC:YES
其他特性:ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 4.15 MHZ地址总线宽度:
位大小:16边界扫描:YES
CPU系列:MSP430最大时钟频率:16 MHz
DAC 通道:NODMA 通道:NO
外部数据总线宽度:格式:FIXED POINT
集成缓存:NOJESD-30 代码:S-PBGA-B49
JESD-609代码:e1低功率模式:YES
湿度敏感等级:1DMA 通道数量:
I/O 线路数量:32串行 I/O 数:2
端子数量:49计时器数量:6
片上数据RAM宽度:8片上程序ROM宽度:8
最高工作温度:85 °C最低工作温度:-40 °C
PWM 通道:YES封装主体材料:PLASTIC/EPOXY
封装代码:VFBGA封装等效代码:BGA49,7X7,16
封装形状:SQUARE封装形式:GRID ARRAY, VERY THIN PROFILE, FINE PITCH
峰值回流温度(摄氏度):260电源:2/3.3 V
认证状态:Not QualifiedRAM(字节):1024
RAM(字数):1ROM(单词):32768
ROM可编程性:FLASH座面最大高度:0.625 mm
速度:16 MHz子类别:Microcontrollers
最大压摆率:0.55 mA最大供电电压:3.6 V
最小供电电压:3.3 V标称供电电压:2.7 V
表面贴装:YES技术:BIPOLAR
温度等级:INDUSTRIAL端子面层:Tin/Silver/Copper (Sn/Ag/Cu)
端子形式:BALL端子节距:0.4 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
uPs/uCs/外围集成电路类型:MICROCONTROLLER, RISCBase Number Matches:1

MSP430F2274IYFFT 数据手册

 浏览型号MSP430F2274IYFFT的Datasheet PDF文件第2页浏览型号MSP430F2274IYFFT的Datasheet PDF文件第3页浏览型号MSP430F2274IYFFT的Datasheet PDF文件第4页浏览型号MSP430F2274IYFFT的Datasheet PDF文件第5页浏览型号MSP430F2274IYFFT的Datasheet PDF文件第6页浏览型号MSP430F2274IYFFT的Datasheet PDF文件第7页 
MSP430F22x2  
MSP430F22x4  
www.ti.com  
SLAS504G JULY 2006REVISED AUGUST 2012  
MIXED SIGNAL MICROCONTROLLER  
1
FEATURES  
23  
Low Supply Voltage Range: 1.8 V to 3.6 V  
Two Configurable Operational Amplifiers  
(MSP430F22x4 Only)  
Ultra-Low Power Consumption  
Brownout Detector  
Active Mode: 270 µA at 1 MHz, 2.2 V  
Standby Mode: 0.7 µA  
Serial Onboard Programming, No External  
Programming Voltage Needed, Programmable  
Code Protection by Security Fuse  
Off Mode (RAM Retention): 0.1 µA  
Ultra-Fast Wake-Up From Standby Mode in  
Less Than 1 µs  
Bootstrap Loader  
On-Chip Emulation Module  
Family Members Include:  
16-Bit RISC Architecture, 62.5-ns Instruction  
Cycle Time  
MSP430F2232  
Basic Clock Module Configurations  
8KB + 256B Flash Memory  
512B RAM  
Internal Frequencies up to 16 MHz With  
Four Calibrated Frequencies to ±1%  
Internal Very-Low-Power Low-Frequency  
Oscillator  
MSP430F2252  
16KB + 256B Flash Memory  
512B RAM  
32-kHz Crystal  
High-Frequency (HF) Crystal up to 16 MHz  
Resonator  
MSP430F2272  
32KB + 256B Flash Memory  
1KB RAM  
External Digital Clock Source  
External Resistor  
MSP430F2234  
16-Bit Timer_A With Three Capture/Compare  
Registers  
8KB + 256B Flash Memory  
512B RAM  
16-Bit Timer_B With Three Capture/Compare  
Registers  
MSP430F2254  
16KB + 256B Flash Memory  
512B RAM  
Universal Serial Communication Interface  
Enhanced UART Supporting Auto-Baudrate  
Detection (LIN)  
MSP430F2274  
32KB + 256B Flash Memory  
1KB RAM  
IrDA Encoder and Decoder  
Synchronous SPI  
I2C™  
Available in a 38-Pin Thin Shrink Small-Outline  
Package (TSSOP) (DA), 40-Pin QFN Package  
(RHA), and 49-Pin Ball Grid Array Package  
(YFF) (See Table 1)  
10-Bit 200-ksps Analog-to-Digital (A/D)  
Converter With Internal Reference, Sample-  
and-Hold, Autoscan, and Data Transfer  
Controller  
For Complete Module Descriptions, See the  
MSP430x2xx Family User's Guide (SLAU144)  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
3
MSP430 is a trademark of Texas Instruments.  
All other trademarks are the property of their respective owners.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2006–2012, Texas Instruments Incorporated  

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