Datasheet > MSCDC200A170D1PAG-Module

MSCDC200A170D1PAG-Module

更新时间： 2023-12-06 20:02:43

品牌	Logo	应用领域
美国微芯 - MICROCHIP		/
页数	文件大小	规格书
9页	806K
描述
SiC Schottky DiodeZero reverse recoveryZero forward recoveryTemperature Independent switching beha

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MSCDC200A170D1PAG-Module 数据手册

Product Overview

•

Stable temperature behavior

Low losses

Direct mounting to heatsink (isolated package)

Low junction-to-case thermal resistance

RoHS compliant

•

2.3

Applications

The MSCDC200A170D1PAG device is designed for the following applications:

•

Uninterruptible power supply (UPS)

Switched mode power supplies

Welding converters

Motor control

•

Microsemi Proprietary and Conﬁdential MSCDC200A170D1PAG Datasheet Revision 1.0

1 2 3 456 7 8 9

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