1010POWERINDUCTORS
High Reliability Power Inductors MS611PYA
■ High temperature materials allow operation in ambient
temperatures up to 155°C
■ Tin-lead (Sn-Pb) termination for the best possible board
adhesion
■ High current and very low DCR
■ Soft saturation makes them ideal for VRM/VRD applications.
Core material Composite
Terminations Tin-lead (63/37) over copper.
Weight 5.7 – 6.3 g
Ambient temperature –55°C to +105°C with Irms current, +105°C
to +155°C with derated current
Storage temperature Component: –55°C to +155°C.
Tape and reel packaging: –55°C to +80°C
Resistance to soldering heat Max three 40 second reflows at
+260°C, parts cooled to room temperature between cycles
Moisture Sensitivity Level (MSL) 1 (unlimited floor life at <30°C /
85% relative humidity)
Enhanced crush-resistant packaging 300/13″ reel
Plastic tape: 24 mm wide, 0.4 mm thick, 16 mm pocket spacing,
10.21 mm pocket depth
DCR (mOhms)3
SRF (MHz)4
min typ
Irms (A)6
±0°C rise 40°C rise
Inductance2
±±0ꢀ (µH)
Part number1
typ
max
Isat (A)5
MS611PYA221MSZ
MS611PYA451MSZ
MS611PYA102MSZ
MS611PYA152MSZ
MS611PYA222MSZ
0.22
0.45
1.0
1.5
2.2
0.33
0.60
1.00
1.60
2.55
0.37
0.66
1.10
1.76
2.80
92
53
34
26
18
115
66
42
33
22
98.8
70.5
55.0
36.6
34.0
30.8
30.0
24.0
23.3
18.4
41.6
39.8
32.6
30.4
24.0
MS611PYA332MSZ
MS611PYA472MSZ
MS611PYA562MSZ
MS611PYA682MSZ
MS611PYA822MSZ
3.3
4.7
5.6
6.8
8.2
3.70
5.20
6.30
8.10
11.70
4.10
5.70
6.93
8.90
12.90
17
15
13
11
9
21
19
16
14
12
27.4
25.4
23.6
21.8
18.3
13.7
13.1
11.8
10.5
9.7
18.8
18.0
15.9
13.9
12.8
MS611PYA103MSZ
MS611PYA153MSZ
10
15
13.40
16.90
14.75
18.60
8
7
11
9
17.5
15.5
8.6
7.4
11.6
10.4
1. When ordering, please specify testing code:
MS611PYA68±MSZ
Irms Testing
Irms testing was performed on a
0.060″ thick pcb with 4 oz. copper
traces optimized to minimize
additional temperature rise.
Testing:
Z = COTS
H = Screening per Coilcraft CP-SA-10001
N = Screening per Coilcraft CP-SA-10004
2. Inductance tested at 100 kHz, 0.1 Vrms, 0 Adc.
Temperature rise is highly
dependent on many factors
including pcb land pattern,
trace size, and proximity to
other components. Therefore
temperature rise should be
verified in application conditions.
3. DCR measured on a micro-ohmmeter.
4. SRF measured using an Agilent/HP 4395A or equivalent.
5. Typical dc current at which the inductance drops 30% from its value without current.
6. Typical current that causes the specified temperature rise from 25°C ambient.
7. Electrical specifications at 25°C.
Refer to Doc 362 “Soldering Surface Mount Components” before soldering.
Document MS804-1 Revised 08/14/12
®
This product may not be used in medical or high
risk applications without prior Coilcraft approval.
Email cps@coilcraft.com Specifications subject to change without notice.
www.coilcraft-cps.com Please check our web site for latest information.
Fax 847-639-1508
1102 Silver Lake Road
Cary, IL 60013
Phone 800-981-0363
© Coilcraft, Inc. 2012