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MS611PYA562MSZ PDF预览

MS611PYA562MSZ

更新时间: 2024-01-25 21:06:44
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线艺 - COILCRAFT /
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4页 295K
描述
High Reliability Power Inductors

MS611PYA562MSZ 数据手册

 浏览型号MS611PYA562MSZ的Datasheet PDF文件第2页浏览型号MS611PYA562MSZ的Datasheet PDF文件第3页浏览型号MS611PYA562MSZ的Datasheet PDF文件第4页 
1010POWERINDUCTORS  
High Reliability Power Inductors MS611PYA  
High temperature materials allow operation in ambient  
temperatures up to 155°C  
Tin-lead (Sn-Pb) termination for the best possible board  
adhesion  
High current and very low DCR  
Soft saturation makes them ideal for VRM/VRD applications.  
Core material Composite  
Terminations Tin-lead (63/37) over copper.  
Weight 5.7 – 6.3 g  
Ambient temperature –55°C to +105°C with Irms current, +105°C  
to +155°C with derated current  
Storage temperature Component: –55°C to +155°C.  
Tape and reel packaging: –55°C to +80°C  
Resistance to soldering heat Max three 40 second reflows at  
+260°C, parts cooled to room temperature between cycles  
Moisture Sensitivity Level (MSL) 1 (unlimited floor life at <30°C /  
85% relative humidity)  
Enhanced crush-resistant packaging 300/13reel  
Plastic tape: 24 mm wide, 0.4 mm thick, 16 mm pocket spacing,  
10.21 mm pocket depth  
DCR (mOhms)3  
SRF (MHz)4  
min typ  
Irms (A)6  
±0°C rise 40°C rise  
Inductance2  
±±0ꢀ (µH)  
Part number1  
typ  
max  
Isat (A)5  
MS611PYA221MSZ  
MS611PYA451MSZ  
MS611PYA102MSZ  
MS611PYA152MSZ  
MS611PYA222MSZ  
0.22  
0.45  
1.0  
1.5  
2.2  
0.33  
0.60  
1.00  
1.60  
2.55  
0.37  
0.66  
1.10  
1.76  
2.80  
92  
53  
34  
26  
18  
115  
66  
42  
33  
22  
98.8  
70.5  
55.0  
36.6  
34.0  
30.8  
30.0  
24.0  
23.3  
18.4  
41.6  
39.8  
32.6  
30.4  
24.0  
MS611PYA332MSZ  
MS611PYA472MSZ  
MS611PYA562MSZ  
MS611PYA682MSZ  
MS611PYA822MSZ  
3.3  
4.7  
5.6  
6.8  
8.2  
3.70  
5.20  
6.30  
8.10  
11.70  
4.10  
5.70  
6.93  
8.90  
12.90  
17  
15  
13  
11  
9
21  
19  
16  
14  
12  
27.4  
25.4  
23.6  
21.8  
18.3  
13.7  
13.1  
11.8  
10.5  
9.7  
18.8  
18.0  
15.9  
13.9  
12.8  
MS611PYA103MSZ  
MS611PYA153MSZ  
10  
15  
13.40  
16.90  
14.75  
18.60  
8
7
11  
9
17.5  
15.5  
8.6  
7.4  
11.6  
10.4  
1. When ordering, please specify testing code:  
MS611PYA68±MSZ  
Irms Testing  
Irms testing was performed on a  
0.060thick pcb with 4 oz. copper  
traces optimized to minimize  
additional temperature rise.  
Testing:  
Z = COTS  
H = Screening per Coilcraft CP-SA-10001  
N = Screening per Coilcraft CP-SA-10004  
2. Inductance tested at 100 kHz, 0.1 Vrms, 0 Adc.  
Temperature rise is highly  
dependent on many factors  
including pcb land pattern,  
trace size, and proximity to  
other components. Therefore  
temperature rise should be  
verified in application conditions.  
3. DCR measured on a micro-ohmmeter.  
4. SRF measured using an Agilent/HP 4395A or equivalent.  
5. Typical dc current at which the inductance drops 30% from its value without current.  
6. Typical current that causes the specified temperature rise from 25°C ambient.  
7. Electrical specifications at 25°C.  
Refer to Doc 362 “Soldering Surface Mount Components” before soldering.  
Document MS804-1 Revised 08/14/12  
This product may not be used in medical or high  
risk applications without prior Coilcraft approval.  
Email cps@coilcraft.com Specifications subject to change without notice.  
www.coilcraft-cps.com Please check our web site for latest information.  
Fax 847-639-1508  
1102 Silver Lake Road  
Cary, IL 60013  
Phone 800-981-0363  
© Coilcraft, Inc. 2012  

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