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MS2215 PDF预览

MS2215

更新时间: 2024-11-14 22:29:51
品牌 Logo 应用领域
美高森美 - MICROSEMI 晶体晶体管射频微波电子航空
页数 文件大小 规格书
3页 150K
描述
RF & MICROWAVE TRANSISTORS AVIONICS APPLICATIONS

MS2215 数据手册

 浏览型号MS2215的Datasheet PDF文件第2页浏览型号MS2215的Datasheet PDF文件第3页 
140 COMMERCE DRIVE  
MONTGOMERYVILLE, PA  
18936-1013  
PHONE: (215) 631-9840  
FAX: (215) 631-9855  
MS2215  
RF & MICROWAVE TRANSISTORS  
AVIONICS APPLICATIONS  
Features  
·
·
·
·
·
·
·
REFRACTORY/GOLD METALLIZATION  
EMITTER SITE BALLASTED  
LOW THERMAL RESISTANCE  
INPUT/OUTPUT MATCHING  
OVERLAY GEOMETRY  
METAL/CERAMIC HERMETIC PACKAGE  
POUT = 150 W MIN. WITH 7.5 dB Gain  
DESCRIPTION:  
The MS2215 is designed for specialized avionics applications,  
including Mode-S, TCAS and JTIDS where power is provided  
under pulse formats utilizing short pulse widths and high burst or  
overall duty cycles.  
ABSOLUTE MAXIMUM RATINGS (Tcase = 25°C)  
Symbol  
PDISS  
IC  
Parameter  
Value  
300  
16.5  
35  
Unit  
Power Dissipation *  
(TC £  
°C)  
Device Current *  
A
V
VCC  
Collector - Supply Voltage *  
TJ  
TSTG  
Junction Temperature (Pulsed RF Operation)  
Storage Temperature *  
250  
- 65 to + 200  
°C  
°C  
Thermal Data  
RTH(j-c)  
Junction-Case Thermal Resistance *  
0.57  
°C/W  
* Applies only to rated RF amplifier operation  
MSC0921.PDF 9-23-98  

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