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MRF9811T1 PDF预览

MRF9811T1

更新时间: 2024-11-08 22:31:39
品牌 Logo 应用领域
摩托罗拉 - MOTOROLA 晶体晶体管
页数 文件大小 规格书
4页 55K
描述
HIGH FREQUENCY GaAs FET TRANSISTOR

MRF9811T1 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:SMALL OUTLINE, R-PDSO-G4Reach Compliance Code:unknown
风险等级:5.92外壳连接:SOURCE
配置:SINGLE最小漏源击穿电压:10 V
最大漏极电流 (Abs) (ID):0.7 A最大漏极电流 (ID):0.7 A
FET 技术:METAL SEMICONDUCTOR最高频带:L BAND
JESD-30 代码:R-PDSO-G4JESD-609代码:e0
元件数量:1端子数量:4
工作模式:DEPLETION MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL功耗环境最大值:0.77 W
认证状态:Not Qualified子类别:Other Transistors
表面贴装:YES端子面层:Tin/Lead (Sn/Pb)
端子形式:GULL WING端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:GALLIUM ARSENIDEBase Number Matches:1

MRF9811T1 数据手册

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Order this document  
by MRF9811T1/D  
SEMICONDUCTOR TECHNICAL DATA  
The RF Small Signal Line  
N–Channel Depletion–Mode MESFET  
Designed for use in driver stages of moderate power RF amplifiers to 2 GHz.  
Typical applications are cellular radios and personal communication  
transmitters such as AMPS, ETACS, NMT, GSM, PCN, JDC and DECT.  
21 dBm, 5.8 V  
HIGH FREQUENCY  
GaAs FET TRANSISTOR  
Performance Specifications at 900 MHz, 5.8 V:  
Output Power = 21 dBm  
Power Gain = 14 dB Min  
Drain Efficiency = 55% Min  
Plastic Surface Mount Package  
Order MRF9811T1 for Tape and Reel Packaging.  
T1 Suffix = 3,000 Units per 8 mm, 7 inch Reel.  
CASE 318A–05, STYLE 7  
(SOT–143)  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
10  
Unit  
Vdc  
Vdc  
Adc  
W
Drain–Source Voltage  
Gate–Source Voltage  
V
DSS  
V
GS  
±5  
Drain Current — Continuous  
I
D
0.7  
Total Device Dissipation @ T = 50°C  
P
D
0.77  
C
Derate above 50°C  
7.7  
55 to +150  
150  
mW/°C  
Storage Temperature Range  
Operating Junction Temperature  
T
stg  
°C  
T
J
°C  
THERMAL CHARACTERISTICS  
Characteristic  
Thermal Resistance, Junction to Case  
Symbol  
Max  
Unit  
R
130  
°C/W  
θJC  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
C
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
Gate–Drain Breakdown Voltage  
(I = 0.25 mA, Source Open)  
V
15  
0.35  
Vdc  
Adc  
(BR)GDO  
GD  
Zero Gate Voltage Drain Current  
(V = 1.5 Vdc, V = 0)  
I
DSS  
DS GS  
Gate–Source Leakage Current  
(V = –5.0 Vdc, Drain Open)  
I
0.5  
10  
µAdc  
GSO  
GS  
NOTE – CAUTION – MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and  
packaging MOS devices should be observed.  
Motorola, Inc. 1997  

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