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MPSA44_06 PDF预览

MPSA44_06

更新时间: 2024-11-03 11:57:23
品牌 Logo 应用领域
安森美 - ONSEMI 晶体晶体管高压
页数 文件大小 规格书
5页 71K
描述
High Voltage Transistor

MPSA44_06 数据手册

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MPSA44  
Preferred Device  
High Voltage Transistor  
NPN Silicon  
Features  
http://onsemi.com  
Pb−Free Packages are Available*  
COLLECTOR  
3
MAXIMUM RATINGS  
Rating  
CollectorEmitter Voltage  
CollectorBase Voltage  
EmitterBase Voltage  
Symbol  
Value  
400  
500  
6.0  
Unit  
Vdc  
V
2
CEO  
BASE  
V
V
Vdc  
CBO  
Vdc  
EBO  
1
Collector Current − Continuous  
I
300  
mAdc  
C
EMITTER  
Total Device Dissipation @ T = 25°C  
P
625  
5.0  
mW  
mW/°C  
A
D
Derate above 25°C  
Total Device Dissipation @ T = 25°C  
P
1.5  
12  
W
mW/°C  
MARKING DIAGRAM  
C
D
Derate above 25°C  
Operating and Storage Junction  
Temperature Range  
T , T  
55 to  
+150  
°C  
J
stg  
MPS  
A44  
THERMAL CHARACTERISTICS  
Characteristic  
AYWWG  
TO−92  
G
(TO−226AA)  
CASE 29−11  
STYLE 1  
Symbol  
Max  
Unit  
1
Thermal Resistance,  
Junction−to−Ambient  
R
q
JA  
200  
°C/W  
2
3
Thermal Resistance,  
Junction−to−Case  
R
q
JC  
83.3  
°C/W  
A
Y
= Assembly Location  
= Year  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
WW  
G
= Work Week  
= Pb−Free Package  
(Note: Microdot may be in either location)  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 2 of this data sheet.  
Preferred devices are recommended choices for future use  
and best overall value.  
*For additional information on our Pb−Free strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
August, 2006 − Rev. 4  
MPSA44/D  

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