Datasheet > MPC860TVR80D4

MPC860TVR80D4

更新时间： 2024-01-18 18:37:01

品牌	Logo	应用领域
恩智浦 - NXP		/
页数	文件大小	规格书
78页	529K
描述
PowerQUICC, 32 Bit Power Architecture, 80MHz, Communications Processor, 0 to 95C

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MPC860TVR80D4 数据手册

Thermal Characteristics

Table 4 shows the thermal characteristics for the MPC860.

Table 4. MPC860 Thermal Resistance Data

ZQ / VR

Unit

Rating

Environment

Symbol

MPC860P MPC860P

Mold Compound Thickness

0.85

1.15

Junction-to-ambient

Natural convection

Single-layer board (1s)

•C/W

θJA

Four-layer board (2s2p)

Single-layer board (1s)

Four-layer board (2s2p)

θJMA

Airflow (200 ft/min)

Junction-to-board

θJB

θJC

Junction-to-case

Junction-to-package top Natural convection

Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal

resistance.

Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.

Per JEDEC JESD51-6 with the board horizontal.

Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured

on the top surface of the board near the package.

Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method

(MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature. For exposed pad

packages where the pad would be expected to be soldered, junction-to-case thermal resistance is a simulated value from

the junction to the exposed pad without contact resistance.

Thermal characterization parameter indicating the temperature difference between the package top and the junction

temperature per JEDEC JESD51-2.

MPC860 PowerQUICC Family Hardware Specifications, Rev. 9

Freescale Semiconductor

1...6 7 8910 11 12...78

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MPC860TVR80D4 替代型号

型号	品牌	替代类型	描述	数据表
MPC860PVR80D4	NXP	类似代替	PowerQUICC, 32 Bit Power Architecture SoC, 80MHz, CPM, ENET, ATM, HDLC, PCMCIA, 0 to 95C
MPC860PCZQ66D4	NXP	类似代替	PowerQUICC, 32 Bit Power Architecture SoC, 66MHz, CPM, ENET, ATM, HDLC, PCMCIA, -40 to 95C
MPC855TZQ66D4	NXP	类似代替	PowerQUICC, 32 Bit Power Architecture SoC, 66MHz, CPM, ENET, ATM, HDLC, PCMCIA, 0 to 95C

与MPC860TVR80D4相关器件

型号	品牌	获取价格	描述	数据表
MPC860TZP33	NXP	获取价格	RISC Microprocessor, 32-Bit, 33MHz, CMOS, PBGA357
MPC860TZP33	MOTOROLA	获取价格	Micro Peripheral IC
MPC860TZQ50D4	FREESCALE	获取价格	Hardware Specifications
MPC860TZQ50D4	NXP	获取价格	PowerQUICC, 32 Bit Power Architecture, 50MHz, Communications Processor, 0 to 95C
MPC860TZQ50D4R2	FREESCALE	获取价格	Hardware Specifications
MPC860TZQ50D4R2	NXP	获取价格	32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357
MPC860TZQ66D4	FREESCALE	获取价格	Hardware Specifications
MPC860TZQ66D4	NXP	获取价格	32-BIT, 66MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357
MPC860TZQ80D4	FREESCALE	获取价格	Hardware Specifications
MPC860TZQ80D4	ROCHESTER	获取价格	32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357

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