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MPC8250_05

更新时间: 2024-01-27 22:38:06
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飞思卡尔 - FREESCALE /
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60页 1070K
描述
Hardware Specifications

MPC8250_05 数据手册

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Document Number: MPC8250EC  
Rev. 1, 03/2005  
Freescale Semiconductor  
MPC8250  
Hardware Specifications  
Contents  
This document contains detailed information on power  
1. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
2. Electrical and Thermal Characteristics . . . . . . . . . . . . 6  
3. Clock Configuration Modes . . . . . . . . . . . . . . . . . . . 20  
4. Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29  
5. Package Description . . . . . . . . . . . . . . . . . . . . . . . . . 55  
6. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 58  
7. Document Revision History . . . . . . . . . . . . . . . . . . . 58  
considerations, DC/AC electrical characteristics, and AC  
timing specifications for the MPC8250 PowerQUICC II™  
communications processor.  
The following topics are addressed:  
The MPC8250 is available in two packages—the standard  
ZU package (480 TBGA) and an alternate VR package (516  
PBGA)—as described in Section 4, “Pinout,” and Section 5,  
“Package Description.” For more information on VR  
packages, contact your Freescale sales office. Note that  
throughout this document references to the MPC8250 are  
inclusive of its VR version unless otherwise specified.  
This document contains information on a new product. Specifications and information herein  
are subject to change without notice.  
© Freescale Semiconductor, Inc., 2003, 2005. All rights reserved.  

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