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MMSZ5253BT1G PDF预览

MMSZ5253BT1G

更新时间: 2024-11-02 05:21:59
品牌 Logo 应用领域
安森美 - ONSEMI 稳压器
页数 文件大小 规格书
6页 77K
描述
Zener Voltage Regulators 500 mW SOD−123 Surface Mount

MMSZ5253BT1G 技术参数

是否无铅: 不含铅生命周期:Active
包装说明:CASE 425-04, 2 PIN针数:2
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8541.10.00.50Factory Lead Time:1 week
风险等级:0.45配置:SINGLE
二极管元件材料:SILICON二极管类型:ZENER DIODE
最大动态阻抗:35 ΩJESD-30 代码:R-PDSO-G2
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:2
最高工作温度:150 °C最低工作温度:-55 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性:UNIDIRECTIONAL最大功率耗散:0.5 W
认证状态:Not Qualified标称参考电压:25 V
子类别:Voltage Reference Diodes表面贴装:YES
技术:ZENER端子面层:Tin (Sn)
端子形式:GULL WING端子位置:DUAL
处于峰值回流温度下的最长时间:40最大电压容差:5%
工作测试电流:5 mABase Number Matches:1

MMSZ5253BT1G 数据手册

 浏览型号MMSZ5253BT1G的Datasheet PDF文件第2页浏览型号MMSZ5253BT1G的Datasheet PDF文件第3页浏览型号MMSZ5253BT1G的Datasheet PDF文件第4页浏览型号MMSZ5253BT1G的Datasheet PDF文件第5页浏览型号MMSZ5253BT1G的Datasheet PDF文件第6页 
MMSZ5221BT1 Series  
Preferred Device  
Zener Voltage Regulators  
500 mW SOD−123 Surface Mount  
Three complete series of Zener diodes are offered in the convenient,  
surface mount plastic SOD−123 package. These devices provide a  
convenient alternative to the leadless 34−package style.  
http://onsemi.com  
Features  
500 mW Rating on FR−4 or FR−5 Board  
1
2
Wide Zener Reverse Voltage Range − 2.4 V to 110 V  
Package Designed for Optimal Automated Board Assembly  
Small Package Size for High Density Applications  
General Purpose, Medium Current  
ESD Rating of Class 3 (>16 kV) per Human Body Model  
Pb−Free Packages are Available  
Cathode  
Anode  
SOD−123  
CASE 425  
STYLE 1  
2
1
Mechanical Characteristics:  
CASE: Void-free, transfer-molded, thermosetting plastic case  
FINISH: Corrosion resistant finish, easily solderable  
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:  
260°C for 10 Seconds  
MARKING DIAGRAM  
POLARITY: Cathode indicated by polarity band  
FLAMMABILITY RATING: UL 94 V−0  
xx M G  
1
G
xx = Device Code (Refer to page 3)  
MAXIMUM RATINGS  
M
= Date Code  
Rating  
Symbol  
Max  
Unit  
G
= Pb−Free Package  
(Note: Microdot may be in either location)  
Total Power Dissipation on FR−5 Board,  
P
D
(Note 1) @ T = 75°C  
500  
6.7  
mW  
mW/°C  
L
Derated above 75°C  
ORDERING INFORMATION  
Thermal Resistance, Junction−to−Ambient  
(Note 2)  
R
340  
°C/W  
°C/W  
°C  
q
JA  
Device  
Package  
Shipping  
Thermal Resistance, Junction−to−Lead  
(Note 2)  
R
q
JL  
150  
MMSZ52xxBT1  
SOD−123  
3000/Tape & Reel  
3000/Tape & Reel  
MMSZ52xxBT1G SOD−123  
(Pb−Free)  
Junction and Storage Temperature Range T , T  
−55 to +150  
J
stg  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits are  
exceeded, device functional operation is not implied, damage may occur and  
reliability may be affected.  
1. FR−5 = 3.5 X 1.5 inches, using the minimum recommended footprint.  
2. Thermal Resistance measurement obtained via infrared Scan Method.  
MMSZ52xxBT3  
SOD−123 10000/Tape & Reel  
MMSZ52xxBT3G SOD−123 10000/Tape & Reel  
(Pb−Free)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
DEVICE MARKING INFORMATION  
See specific marking information in the device marking  
column of the Electrical Characteristics table on page 3 of  
this data sheet.  
Devices listed in bold, italic are ON Semiconductor  
Preferred devices. Preferred devices are recommended  
choices for future use and best overall value.  
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
January, 2006 − Rev. 7  
MMSZ5221BT1/D  
 

MMSZ5253BT1G 替代型号

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MMSZ4710T1G ONSEMI

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