Datasheet > MMSZ5253ET1G

MMSZ5253ET1G

更新时间： 2024-11-28 12:04:43

品牌	Logo	应用领域
安森美 - ONSEMI		稳压器
页数	文件大小	规格书
6页	154K
描述
Zener Voltage Regulators 500 mW SODâ123 Surface Mount

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中文翻译

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MMSZ5253ET1G 数据手册

MMSZ52xxET1G Series,

SZMMSZ52xxET1G Series

Zener Voltage Regulators

500 mW SOD−123 Surface Mount

Three complete series of Zener diodes are offered in the convenient,

surface mount plastic SOD−123 package. These devices provide a

convenient alternative to the leadless 34−package style.

http://onsemi.com

Features

 500 mW Rating on FR−4 or FR−5 Board

 Wide Zener Reverse Voltage Range − 2.4 V to 110 V

 Package Designed for Optimal Automated Board Assembly

 Small Package Size for High Density Applications

 General Purpose, Medium Current

SOD−123

CASE 425

STYLE 1

 ESD Rating of Class 3 (> 16 kV) per Human Body Model

 Peak Power − 225 W (8 x 20 ms)

Cathode

Anode

 SZ Prefix for Automotive and Other Applications Requiring Unique

Site and Control Change Requirements; AEC−Q101 Qualified and

PPAP Capable

MARKING DIAGRAM

 Pb−Free Packages are Available*

Mechanical Characteristics:

xxx M G

CASE: Void-free, transfer-molded, thermosetting plastic case

FINISH: Corrosion resistant finish, easily solderable

MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:

260C for 10 Seconds

POLARITY: Cathode indicated by polarity band

FLAMMABILITY RATING: UL 94 V−0

xxx = Device Code (Refer to page 2)

= Date Code

= Pb−Free Package

(Note: Microdot may be in either location)

MAXIMUM RATINGS

ORDERING INFORMATION

Rating

Symbol

Max

Units

225

†

Peak Power Dissipation @ 20 ms (Note 1)

Device

Package

Shipping

@ T  25C

MMSZ52xxET1G

SOD−123

(Pb−Free)

3,000 /

Total Power Dissipation on FR−5 Board,

Tape & Reel

(Note 3) @ T = 75C

500

6.7

mW/C

Derated above 75C

SZMMSZ52xxET1G SOD−123

(Pb−Free)

3,000 /

Tape & Reel

Thermal Resistance, (Note 2)

Junction−to−Ambient

C/W

C

340

MMSZ52xxET3G

SOD−123

(Pb−Free)

10,000 /

Tape & Reel

Thermal Resistance, (Note 2)

Junction−to−Lead

150

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

Junction and Storage Temperature Range

T , T

−55 to

+150

stg

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. Nonrepetitive current pulse per Figure 11.

2. Thermal Resistance measurement obtained via infrared Scan Method.

3. FR−5 = 3.5 x 1.5 inches, using the minimum recommended footprint.

DEVICE MARKING INFORMATION

See specific marking information in the device marking

column of the Electrical Characteristics table on page 2 of

this data sheet.

*For additional information on our Pb−Free strategy and soldering details, please

download the ON Semiconductor Soldering and Mounting Techniques

Reference Manual, SOLDERRM/D.

 Semiconductor Components Industries, LLC, 2012

Publication Order Number:

February, 2012 − Rev. 8

MMSZ5221ET1/D

12 3 4 5 6

中文翻译

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