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MMSZ5253BT1 PDF预览

MMSZ5253BT1

更新时间: 2024-11-27 23:02:47
品牌 Logo 应用领域
摩托罗拉 - MOTOROLA 稳压二极管测试光电二极管
页数 文件大小 规格书
7页 105K
描述
Surface Mount Silicon Zener Diodes

MMSZ5253BT1 技术参数

是否Rohs认证: 不符合生命周期:Transferred
包装说明:R-PDSO-G2Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8541.10.00.50
风险等级:5.84配置:SINGLE
二极管元件材料:SILICON二极管类型:ZENER DIODE
JESD-30 代码:R-PDSO-G2JESD-609代码:e0
膝阻抗最大值:600 Ω元件数量:1
端子数量:2最高工作温度:150 °C
最低工作温度:-55 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性:UNIDIRECTIONAL
最大功率耗散:0.5 W认证状态:Not Qualified
标称参考电压:25 V最大反向电流:0.1 µA
表面贴装:YES技术:ZENER
端子面层:Tin/Lead (Sn/Pb)端子形式:GULL WING
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
最大电压容差:5%工作测试电流:5 mA
Base Number Matches:1

MMSZ5253BT1 数据手册

 浏览型号MMSZ5253BT1的Datasheet PDF文件第2页浏览型号MMSZ5253BT1的Datasheet PDF文件第3页浏览型号MMSZ5253BT1的Datasheet PDF文件第4页浏览型号MMSZ5253BT1的Datasheet PDF文件第5页浏览型号MMSZ5253BT1的Datasheet PDF文件第6页浏览型号MMSZ5253BT1的Datasheet PDF文件第7页 
MOTOROLA  
SEMICONDUCTOR  
TECHNICAL DATA  
Designer’s Data Sheet  
Three complete series of Zener Diodes are offered in the convenient, surface mount  
plastic SOD-123 package. These devices provide a convenient alternative to the leadless  
34 package style.  
PLASTIC SURFACE  
MOUNT  
ZENER DIODES  
500 MILLIWATTS  
1.891 VOLTS  
500 mW Rating on FR-4 or FR-5 Board  
Package Designed for Optimal Automated Board Assembly  
Corrosion Resistant Finish, Easily Solderable  
ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model  
Small Package Size for High Density Applications  
Available in 8 mm Tape and Reel  
Add “T1” to the device number to order the 7 inch/3000 unit reel.  
Add “T3” to the device number to order the 13 inch/10,000 unit reel.  
Wafer Fab Location: Phoenix, Arizona  
1
2
1: CATHODE  
2: ANODE  
Assembly/Test Location: Seremban, Malaysia  
MMSZ5221BT1 thru MMSZ5270BT1  
General Purpose, Medium Current  
Wide Voltage Range — 2.4 to 91 Volts  
CASE 425, STYLE 1  
PLASTIC  
DEVICE RATING (T = 25°C unless otherwise noted)  
A
Rating  
Symbol  
Value  
Unit  
[1]  
Power Dissipation on FR-4 or FR-5 Board  
P
500  
6.7  
mW  
mW/°C  
D
Derate above T = 75°C  
L
[2]  
Thermal Resistance Junction to Lead  
R
R
150  
340  
θJL  
θJA  
°C/W  
[2]  
Thermal Resistance Junction to Ambient  
Junction Temperature Range  
T
–55 to +150  
–55 to +150  
260  
°C  
°C  
°C  
J
Storage Temperature Range  
T
stg  
Lead Solder Temperature – Maximum (10 sec. duration)  
[1]  
[2]  
FR-4 or FR-5 = 3.5 x 1.5 inches, using the Motorola minimum recommended footprint as shown in Figure 11.  
Thermal Resistance measurement obtained via Infrared Scan Method  
Designer’s Data for “Worst Case’’ Conditions — The Designer’s Data Sheet permits the design of most circuits entirely from the information presented. Limit curves — representing  
boundaries on device characteristics — are given to facilitate “worst case’’ design.  
Designer’s is a trademark of Motorola, Inc.  
Thermal Clad is a trademark of the Bergquist Company.  
Preferred devices are Motorola recommended choices for future use and best overall value.  
Motorola TVS/Zener Device Data  
500 mW Leadless (SOD-123) Data Sheet  
7-1  

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